Provided is an oscillator including a resonator which includes a resonator element and a resonator element container accommodating the resonator element, an integrated circuit element which includes an inductor, and a nonconductive spacer member, in which the resonator and the integrated circuit element are stacked above each other, the resonator has a metal member, and the spacer member is provided between the resonator and the integrated circuit element.

An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

A vibrator device includes a circuit element, which has a first terminal and is a quadrangle in plan view, a vibrator, which is disposed on an active surface and is a quadrangle in plan view, a base, on which the circuit element is disposed and which has a second terminal, and a wire which connects the first terminal and the second terminal together. In plan view of the circuit element, at least one side of the vibrator is disposed along a direction where the one side intersects each of two adjacent sides of the circuit element, and the vibrator does not overlap the first terminal.

A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

An oven-controlled crystal oscillator includes a base substrate, a power transistor, and a surface mount type crystal resonator. The base substrate has a bottom surface on which a mounting terminal for surface mounting is disposed. The power transistor is mounted on the base substrate. The surface mount type crystal resonator is mounted on the power transistor.

A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

Provided is an oscillator including a resonator which includes a resonator element and a resonator element container accommodating the resonator element, an integrated circuit element which includes an inductor, and a nonconductive spacer member, in which the resonator and the integrated circuit element are stacked above each other, the resonator has a metal member, and the spacer member is provided between the resonator and the integrated circuit element.

A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.