A Chip on Film (COF) package and a display device including the same are provided. The COF package includes: a film substrate; a chip arranged within a chip region on the film substrate; outer leads; and inner leads. The outer leads are arranged on the same side of the chip region and arranged as at least two rows of outer leads. The inner leads are arranged on a first side and a second side of the chip and connected with the chip. The at least two rows of outer leads include a first row and a second row of outer leads, the first row of outer leads are between the second row of outer leads and the chip, and wirings between at least part of leads among the second row of outer leads and the inner leads on the second side of the chip adopt a closed-loop like connection mode.

The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

A method is disclosed for mounting and cooling a circuit component having aplurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive and electrically insulating material with a circuit board arranged between the circuit component and the substrate. The circuit board, which has a flexible base and carries conductive traces that terminate in contact pads, is secured to the rigid substrate with at least some of the contact pads on the circuit board disposed on the side of the circuit board facing the rigid substrate, at least some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the flexible base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate. The side of the contact pads exposed by the holes is plated to form conductive vias that fill the holes and that are soldered to the contacts of the circuit component.

An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

A chip on film package according to one embodiment of the present disclosure includes: a base film; a wiring unit located on the base film; a semiconductor chip mounted on the wiring unit; a first heat dissipation unit configured to come into contact with the semiconductor chip; a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprise a metal; and an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween.

A package structure includes a carrier substrate, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.

An electronic device is provided. The electronic device includes a supporting substrate, a flexible substrate disposed on the supporting substrate, a first conductive layer disposed on the flexible substrate, a second conductive layer disposed on the first conductive layer, a plurality of organic elements disposed between the first conductive layer and the second conductive layer, and an opening passing through the supporting substrate and exposing a portion of the flexible substrate. The first conductive layer alternately contacts the second conductive layer and the plurality of organic elements.

In a semiconductor package, flow guiding strips are provided on a guiding area of a flexible substrate to separate a chip and the flexible substrate such that a filling material flowing between the chip and the flexible substrate can squeeze out the air between the chip and the flexible substrate to improve the reliability of the semiconductor package.