A semiconductor device includes: a first semiconductor element including a first face and a second face; a second semiconductor element including a third face and a fourth face; an insulating base member including a fifth face and a sixth face; a first wiring that penetrates through the insulating base member, and is disposed on the sixth face; a second wiring that penetrates through the insulating base member, and is disposed on the sixth face; a first wiring member that faces the second face; and a second wiring member that faces the sixth face, and is electrically connected to the second wiring. The second wiring member is bonded to the first and second wirings while the insulating base member is folded. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.

A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member adhesively bonded to the first semiconductor element; a first wiring connected to a first electrode of the first semiconductor element, and disposed on the first insulating base member; a second insulating base member adhesively bonded to the second semiconductor element, a second wiring connected to a third electrode of the second semiconductor element, and disposed on the second insulating base member; a first wiring member connected to a second electrode of the first semiconductor element; a second wiring member electrically connected to the first wiring and a fourth electrode of the second semiconductor element; and a third wiring member connected to the second wiring. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the third wiring member.

A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

The present disclosure provides a package structure and a packaging method. The package structure provided by the present disclosure includes: a package base and a redistribution layer disposed on the package base; where the package base includes a plurality of device areas; and a channel set is provided in the device area, where the channel set is used to connect an electronic device, and the redistribution layer is used to lead a subset of to-be-protected channels that needs electrostatic protection in the channel set out to a preset area on the package base, so that all or part of channels in the subset of to-be-protected channels form a series circuit in the preset area, and the series circuit is used to connect with an electrostatic discharge end. The package structure of the present disclosure can provide electrostatic protection for the channel that needs to be protected during a packaging process.

When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.

A chip on film assembly, a display panel, and a display module are disclosed. The chip on film assembly includes a substrate, an input terminal disposed on a first end of the substrate, a plurality of output terminals disposed on a second end of the substrate, wherein the second end is opposite to the first end, and a plurality of driving chips disposed on a surface of the substrate. The driving chips are electrically connected to the input terminal and are electrically connected to the output terminals by one to one, so space utilization of chip on films (COFs) can be improved, and a problem of insufficient COF bonding spaces for high-resolution products can be solved.

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

According to one embodiment, a display device includes a first substrate including a first area and a second area, the first area including a display area where pixels are arranged, and the second area being adjacent to the first area and where wirings are arranged, wherein the wirings are covered with a protection layer, the second area includes a peripheral area and a central area in an arrangement direction of the wirings, and a thickness of at least one of the first substrate and the protection layer varies between the peripheral area and the central area.