A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.

An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.

A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

A three-dimensional (3D) integrated circuit (IC) includes a first IC die and a second IC die. The first IC die includes a first semiconductor substrate, and a first interconnect structure over the first semiconductor substrate. The second IC die includes a second semiconductor substrate, and a second interconnect structure that separates the second semiconductor substrate from the first interconnect structure. A seal ring structure separates the first interconnect structure from the second interconnect structure and perimetrically surrounds a gas reservoir between the first IC die and second IC die. The seal ring structure includes a sidewall gas-vent opening structure configured to allow gas to pass between the gas reservoir and an ambient environment surrounding the 3D IC.

Interconnecting a first chip and a second chip includes mounting the first and second chips to a chip handler having an opening and at least one support surface. Each of the first chip and the second chip has a first surface including a first set of terminals and a second surface opposite to the first surface. The first surface of the first chip and the first surface of the second chip mounted to the chip handler are supported by the at least one support surface of the chip handler. The first and second chips are placed on a chip support member with the chip handler from the second surfaces. A bridge member is inserted by a bridge handler through the opening of the chip handler to place the bridge member onto the first sets of terminals of the first and second chips that are exposed from the opening.

The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.