The package structure having packaged components within includes a circuit board, multiple packaged light detecting components mounted on the circuit board, a sealing cap being light transmittable, multiple light filtering films mounted on the sealing cap, and a supporting annular wall. The two opposite ends of the supporting annular wall are adhesively bonded to the surfaces of the circuit board and the sealing cap, such that the projection on the circuit board of the light filtering films corresponds the packaged light detecting components. Since the light filtering films have different filtering frequency bands, each packaged light detecting component detects light of different frequency bands in one incident light beam. The package method is simple and stable, effectively lowering the manufacture cost of the light detecting module.

A portable electronic device and an image capturing module thereof are disclosed. The image capturing module includes a circuit substrate, a structure reinforcing frame, a plurality of image sensing chips, an adhesive body, and a plurality of lens modules. The circuit substrate has a plurality of first passing openings. The structure reinforcing frame is disposed on the circuit substrate, and the structure reinforcing frame has a plurality of second passing openings respectively communicated with the first passing openings. The image sensing chips is electrically connected with the circuit substrate by wire bonding, and the image sensing chips are coplanarly disposed on a datum plane. The adhesive body is connected between each image sensing chip and the structure reinforcing frame. The lens modules are disposed on the circuit substrate, and the lens modules respectively correspond to the image sensing chips.

A phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, and a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, and the insulating substrate contains a bismaleimide resin and glass cloth.

The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

Embodiments of a method for packaging Integrated Circuit (IC) dies and an IC device are described. In an embodiment, a method for packaging IC dies involves creating openings on a substrate, where side surfaces of the openings on the substrate are covered by metal layers, placing the IC dies into the openings on the substrate, applying a second metal layer to the substrate, where the IC dies are electrically connected to at least a portion of the second metal layer, and cutting the substrate into IC devices.

In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface are brought together, such that they are directly adjacent to each other and such that a direct electrical contact is formed between the contact layer and the connection layer.

An electronic device includes a substrate, a plurality of micro semiconductor structure, a plurality of conductive members, and a non-conductive portion. The substrate has a first surface and a second surface opposite to each other. The micro semiconductor structures are distributed on the first surface of the substrate. The conductive members electrically connect the micro semiconductor structures to the substrate. Each conductive member is defined by an electrode of one of the micro semiconductor structures and a corresponding conductive pad on the substrate. The non-conductive portion is arranged on the first surface of the substrate. The non-conductive portion includes one or more non-conductive members, and the one or more non-conductive members are attached to the corresponding one or more conductive members of the one or more micro conductive structures.