A method for manufacturing an electronic device includes: providing a base layer; forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening; placing an electronic element on the patterned circuit layer; and patterning the base layer to form a second opening which is at least partially overlapped with the first opening. The step of placing the electronic element is performed after the step of forming the patterned circuit layer.

A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

A display device includes: a substrate; a partition wall on the substrate; a plurality of light emitting areas on the substrate, the light emitting areas including a first light emitting area, a second light emitting area, and a third light emitting area partitioned by the partition wall; a first light emitting element in the first light emitting area and configured to emit first light; a second light emitting element in the second light emitting area and configured to emit second light; and a third light emitting element in the third light emitting area and configured to emit third light. An area of the first light emitting area is larger than an area of the first light emitting element and is larger than an area of the second light emitting area and an area of the third light emitting area.

Enhanced probe cards, for testing unpackaged semiconductor die including numerous discrete devices (e.g., LEDs), are described. The die includes anodes and cathodes for the LEDs. Via a single touchdown event, the probe card may simultaneously operate each of the LEDs. The LEDs' optical output is measured and the performance of the die is characterized. The probe card includes a conductive first contact and another contact that are fabricated from a conformal sheet or film. Upon the touchdown event, the first contact makes contact with each of the die's anodes and the other contact makes contact with each of the die's cathodes. The vertical and sheet resistance of the contacts are sufficient such that the voltage drop across the vertical dimension of the contacts is approximately an order of magnitude greater than the operating voltage of the LEDs and current-sharing between adjacent LEDs is limited by the sheet resistance.

Eye-tracking systems and methods utilize transparent illumination structures having a plurality of IR μLEDs distributed within the transparent viewing area of illumination structures. The μLEDs are small enough (<100 μm) that they are not visible by a user during use of an HMD or other mixed-reality device, for example, such that they can be positioned within the line-of-sight of the user through the illumination structure and without visibly obscuring or interfering with the user's view of the mixed-reality environment by the mixed-reality device.

A foldable display device includes a display panel including a front surface and a rear surface opposite the front surface, the front surface including a first component area including a first transmissive portion, a second component area including a second transmissive portion, and a main display area at least partially surrounding the first component area and the second component area, wherein, in a state in which the foldable display device is folded about a first folding axis that crosses the main display area such that two areas of the front surface or two areas of the rear surface face each other, the first component area and the second component area overlap each other on a plane.

A light emitting device is provided. The light emitting device includes a light emitting assembly having a first light emitting diode package structure and a second light emitting diode package structure. The light emitting assembly can generate a mixed light source having a spectral deviation index. The first light emitting diode package structure can generate a first light source having a first spectral deviation index. The second light emitting diode package structure can generate a second light source having a second spectral deviation index. When the first light source and the second light source are within a range from 460 to 500 nm, a sum of the first spectral deviation index and the second spectral deviation index is within a range from −0.3 to 0.3, and a difference between the first spectral deviation index and the second spectral deviation index is at least greater than 0.2.

A system includes a display. The display includes an array of LEDs covered by a transparent material. The array of LEDs includes a plurality of first, second, third, and fourth LEDs respectively configured to emit red, green, blue, and violet light. The red, green, and blue light from the first, second, and third LEDs is visible to human eye. Violet light from the fourth LEDs is invisible to human eye. The system includes a photocatalytic coating disposed on the transparent material. The photocatalytic coating includes a photo-catalyst responsive to ultraviolet radiation present in sunlight and to the violet light emitted by the fourth LEDs in the array of LEDs. The system includes a controller configured to selectively turn on the fourth LEDs to activate the photo-catalyst in the photocatalytic coating disposed on the transparent material.

A preparation method of a display panel includes: forming multiple compensation groups on a substrate to obtain an array substrate, where the multiple compensation groups include at least first compensation group and second compensation group, and brightness difference of light-emitting elements of same light-emitting color in the first compensation group and the second compensation group under a same gray scale is larger than a preset value; calculating thicknesses of first color film layer, second color film layer and third color film layer corresponding to each of the multiple compensation groups respectively; forming the first color film layer, the second color film layer and the third color film layer on light-emitting side of the first light-emitting element, the second light-emitting element, and the third light-emitting element respectively according to the thicknesses of the first color film layer, the second color film layer and the third color film layer obtained by calculation.

A light emitting substrate, a light emitting motherboard, a method for obtaining a light emitting substrate, and a displaying device. The light emitting substrate comprises a substrate and multiple light emitting units, wherein the substrate is provided with a light emitting region and a bind region located on one side of the light emitting region; each light emitting unit comprises a light zone provided with at least one light emitting diode and a drive circuit provided with multiple pins, and the multiple light emitting units are arranged on the substrate in an array; a direction pointing from the light emitting region to the bind region is a first direction; and in the first direction, the drive circuit of at least one light emitting unit in the last row of the light emitting units is connected to an address line.