A semiconductor package includes a first die pad, a first semiconductor die mounted on the first die pad, an encapsulant body of electrically insulating material that encapsulates first die pad and the first semiconductor die, a plurality of package leads that each protrude out of a first outer face of the encapsulant body, a connection lug that protrudes out of a second outer face of the encapsulant body, the second outer face being opposite from the first outer face. The first semiconductor die includes first and second voltage blocking terminals. The connection lug is electrically connected to one of the first and second voltage blocking terminals of the first semiconductor die. A first one of the package leads is electrically connected to an opposite one of the first and second voltage blocking terminals of the first semiconductor die that the first connection lug is electrically connected to.

A method includes providing a first lead frame that includes a first die pad and a first row of leads, providing a connection lug, mounting a first semiconductor die on the first die pad, the first semiconductor die including first and second voltage blocking terminals, electrically connecting the connection lug to one of the first and second voltage blocking terminals, electrically connecting a first one of the leads from the first row to an opposite one of the first and second voltage blocking terminals, and forming an encapsulant body of electrically insulating material that encapsulates first die pad and the first semiconductor die. After forming the encapsulant body, the first row of leads each protrude out of a first outer face of the encapsulant body and the connection lug protrudes out of a second outer face of the encapsulant body.

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.

A transistor module assembly includes a longitudinally extending load bus bar, a longitudinally extending feed bus bar parallel to the load bus bar, and at least one transistor package operatively connected to the load and feed bus bars. The transistor package includes a drain surface and a source lead. The drain surface is operatively connected to the feed bus bar for receiving current therefrom. The source lead is operatively connected to the load bus bar for dissipating current from the transistor package to the load bus bar.

Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.

An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction. A gap is provided between the second back surface and the mounting surface.

A bus assembly includes a planar first bus, a second bus including a first planar bus section on the first bus and a second planar bus section connected to the first planar bus section and offset from the first planar bus section, and a third bus comprising a third planar bus section disposed between the first bus and the second planar bus section, and a fourth planar bus section connected to the third planar bus section, offset from third planar bus section, and disposed on the first planar bus section.

A semiconductor device assembly includes a cooling system, a plurality of semiconductor packages, each including a semiconductor die and an encapsulant body, and a multi-device thermal interface interposed between the plurality of semiconductor packages and the cooling system, wherein the semiconductor packages are each configured as surface mount devices, and wherein the multi-device thermal interface thermally couples each of the semiconductor packages to the cooling system.

Provided is a semiconductor package modularized and manufactured by preparing a main block for putting on a semiconductor chip, an insulator, and one or more sub block, preparing the semiconductor chip, preparing an adhesive used in attaching the semiconductor chip, attaching the semiconductor chip to an upper surface or upper and lower surfaces of the main block, performing an electrical connection of the semiconductor chip, preparing a substrate comprising a pattern enabling an electrical connection and vertically attaching one side of the main block to the pattern of the substrate to enable an electrical connection. In the semiconductor package above, an accumulation rate increases on the substrate due to a vertically arranged structure of the semiconductor chips and a heat emission area is enlarged to improve a heat emission effect.