A power electronics module is provided having one or more power converter semiconductor components. The power electronics module further has a substrate having a first surface to which the one or more components are mounted, and having an opposing second surface from which project a plurality of heat transfer formations for enhancing heat transfer from the substrate. The power electronics module further has a coolant housing which sealingly connects to the substrate to form a void over the heat transfer formations of the second surface. The coolant housing has an inlet for directing a flow of an electrically insulating coolant into the void and an outlet for removing the coolant flow from the void, whereby heat generated during operation of the one or more components is transferred into the coolant flow via the substrate.

A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device includes a first set of through vias between and connecting a top package and a redistribution layer (RDL), the first set of through vias in physical contact with a molding compound and separated from a die. The semiconductor device also includes a first interconnect structure between and connecting the top package and the RDL, the first interconnect structure separated from the die and from the first set of through vias by the molding compound. The first interconnect structure includes a second set of through vias and at least one integrated passive device.

A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

A power converter module includes a ground terminal, an input voltage terminal confirmed to receive a raw input voltage, and an interconnection terminal configured to provide a regulated output voltage to a load such as a SOC or SIP system to be powered. A voltage regulator is connected to the ground terminal and the input voltage terminal. An inductor has an inductor output connected to the interconnection terminal.

A method for manufacturing a semiconductor module includes the step of soldering two or more semiconductor elements having substrate materials and heights different from each other to a metal foil disposed at one side of an insulating substrate; connecting a plurality of wiring members, not interconnecting the semiconductor elements, to front face electrodes of the semiconductor elements through solder so that heights from a surface of the insulating substrate to top faces of the wiring members become same level with each other; inspecting a leakage current while applying electricity on each one of semiconductor elements individually through the wiring members; and connecting the top faces of the wiring members with a bus bar.

A power module (PM) includes: an insulating substrate; a semiconductor device disposed on the insulating substrate, the semiconductor device including electrodes on a front surface side and a back surface side thereof; and a graphite plate having an anisotropic thermal conductivity, the graphite plate of which one end is connected to the front surface side of the semiconductor device and the other end is connected to the insulating substrate, wherein heat of the front surface side of the semiconductor device is transferred to the insulating substrate through the graphite plate. There is provide an inexpensive power module capable of reducing a stress and capable of exhibiting cooling performance not inferior to that of the double-sided cooling structures.

A device includes a first semiconductor chip that is arranged over a first carrier and includes a first electrical contact. The device further includes a second semiconductor chip arranged over a second carrier and including a second electrical contact arranged over a surface of the second semiconductor chip facing the second carrier. The second carrier is electrically coupled to the first electrical contact and the second electrical contact.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A circuit breaker with enhanced convection and cooling comprises a housing having a first portion and a second portion. The circuit breaker further comprises one or more first orientation features formed onto the first portion of the housing. The circuit breaker further comprises one or more second orientation features formed onto the second portion of the housing such that the one or more first orientation features are different from the one or more second orientation features and the first portion of the housing is different than the second portion of the housing. The one or more first orientation features and the one or more second orientation features are assembled together to form air channels to allow air to go in and out while preventing a solid object from protruding and from touching inside components of the circuit breaker.

A semiconductor module is provided, including: a cooling-target device; a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. Also, a semiconductor module manufacturing method is provided, including: placing a cooling-target device on a first cooling unit that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and fixing the first cooling unit to a second cooling unit that has a flow channel coupled with the flow channel of the first cooling unit.