Photodiodes configured to convert incident photons in the short-wave infrared (SWIR) to electric current, where the photodiodes have a PbS/PbCl.sub.x core/shell nanocrystal absorber layer. The PbCl.sub.x shell in the PbS/PbCl.sub.x nanocrystals provide native passivation in the (100) crystal facets and enable removal of pre-device processing ligands and ligand exchange on the (111) crystal facets of the PbS/PbCl.sub.x nanocrystals such that the photodiode exhibits reduced current densities under reverse bias and greater infrared photoresponse, providing improved device performance as compared to photodiodes having absorber layers formed from PbS core nanocrystals alone.

To provide a coating material capable of forming a solar cell module excellent in the weather resistance, the power generation efficiency and the design, a cover glass, a solar cell module comprising the cover glass, and an outer wall material for building. The cover glass of the present invention is a cover glass comprising a glass plate and a layer containing a fluorinated polymer having units based on a fluoroolefin, on at least one surface of the glass plate, which has an average visible reflectance of from 10 to 100%, and an average near infrared transmittance of from 20 to 100%.

A solar cell of an embodiment includes: a p-electrode in which a first p-electrode and a second p-electrode are laminated; a p-type light-absorbing layer in direct contact with the first p-electrode; an n-type layer in direct contact with the p-type light-absorbing layer; and an n-electrode. The first p-electrode is disposed between the p-type light-absorbing layer and the second p-electrode. The p-type light-absorbing layer is disposed between the n-type layer and the first p-electrode. The n-type layer is disposed between the p-type light-absorbing layer and the n-electrode. The first p-electrode includes a metal oxide containing Sn as a main component.

A solar cell of an embodiment includes: a p-electrode in which a first p-electrode and a second p-electrode are laminated; a p-type light-absorbing layer in direct contact with the first p-electrode; an n-type layer in direct contact with the p-type light-absorbing layer; and an n-electrode. The first p-electrode is disposed between the p-type light-absorbing layer and the second p-electrode. The p-type light-absorbing layer is disposed between the n-type layer and the first p-electrode. The n-type layer is disposed between the p-type light-absorbing layer and the n-electrode. The first p-electrode includes a metal oxide containing Sn as a main component.

An imaging device includes a photoelectric conversion unit in which a first electrode, a photoelectric conversion layer, and a second electrode are stacked. A semiconductor material layer including an inorganic oxide semiconductor material having an amorphous structure at least in a portion is formed between the first electrode and the photoelectric conversion layer, and the formation energy of an inorganic oxide semiconductor material that has the same composition as the inorganic oxide semiconductor material having an amorphous structure and has a crystalline structure has a positive value.

An imaging device includes a photoelectric conversion unit in which a first electrode, a photoelectric conversion layer, and a second electrode are stacked. A semiconductor material layer including an inorganic oxide semiconductor material having an amorphous structure at least in a portion is formed between the first electrode and the photoelectric conversion layer, and the formation energy of an inorganic oxide semiconductor material that has the same composition as the inorganic oxide semiconductor material having an amorphous structure and has a crystalline structure has a positive value.

A method of manufacturing an electronic component including a substrate is provided. The method includes generating a plasma remote from a sputter target, generating sputtered material from the sputter target using the plasma, and depositing the sputtered material on a substrate as a crystalline layer.

The present disclosure is directed to methods for producing a photovoltaic junction that can include coating a bare junction with a composition. In one embodiment, the composition includes a plurality of quantum dots to create a film; exposing the film to a ligand to create a first layer; coating the first layer with the composition to form a film on the first layer; and exposing the film on the first layer to the ligand to create a second layer.

Disclosed are a perovskite photoelectric device and a method of fabricating the same. A perovskite photoelectric device according to an embodiment of the present invention includes a first electrode; a hole transport layer formed on the first electrode; a perovskite layer formed on the hole transport layer and made of a first perovskite compound; an electron transport layer formed on the perovskite layer; a second electrode formed on the electron transport layer; and a graded wall formed on the hole transport layer and the perovskite layer and made of a second perovskite compound, wherein the first perovskite compound and the second perovskite compound are represented by Formula 1 below, and the graded wall suppresses movement of anions included in the perovskite layer:

A.sub.aM.sub.bX.sub.c  [Formula 1]

where A is a monovalent cation, M is a divalent or trivalent metal cation, X is a monovalent anion, a+2b=c when M is a divalent metal cation, a+3B=c when M is a trivalent metal cation, and a, b and c are natural numbers.

Disclosed are a perovskite photoelectric device and a method of fabricating the same. A perovskite photoelectric device according to an embodiment of the present invention includes a first electrode; a hole transport layer formed on the first electrode; a perovskite layer formed on the hole transport layer and made of a first perovskite compound; an electron transport layer formed on the perovskite layer; a second electrode formed on the electron transport layer; and a graded wall formed on the hole transport layer and the perovskite layer and made of a second perovskite compound, wherein the first perovskite compound and the second perovskite compound are represented by Formula 1 below, and the graded wall suppresses movement of anions included in the perovskite layer:

A.sub.aM.sub.bX.sub.c  [Formula 1]

where A is a monovalent cation, M is a divalent or trivalent metal cation, X is a monovalent anion, a+2b=c when M is a divalent metal cation, a+3B=c when M is a trivalent metal cation, and a, b and c are natural numbers.