An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.

There is provided a two-terminal device, including a substrate comprising a first cell having a first characteristic resistance, and a second cell, spaced apart from the first cell along the web direction of the substrate, having a second characteristic resistance; a first terminal and a second terminal, each terminal being formed towards or at opposing edges of the substrate across the transverse direction, and each terminal being in electrical communication with the first cell and the second cell; and a connecting portion, between the first cell and the second cell, the connecting portion having a third characteristic resistance; wherein the third characteristic resistance is greater than or equal to at least one of the first characteristic resistance and the second characteristic resistance. There is also provided a method of forming such a two-terminal device).

Discussed is a photodiode and a method for manufacturing the photodiode. The photodiode can include a semiconductor substrate, an insulating layer on the semiconductor substrate, an electrode on the insulating layer; and a graphene layer on the semiconductor substrate, the insulating layer, and the electrode, wherein the insulating layer can include an ion gel.

To improve sensitivity to near-infrared light and suppress deterioration of timing jitter characteristics. A photodetector includes: a pixel region in which a plurality of pixels each having a photoelectric converter is arranged in a matrix, in which the photoelectric converter includes: a first semiconductor portion segmented by a separator; a second semiconductor portion provided on a side of a first face of the first semiconductor portion, the first face being opposite to a second face of the first semiconductor portion, the second semiconductor portion containing germanium; a light absorber with which the second semiconductor portion is provided, the light absorber being configured to absorb light having entered the second semiconductor portion to generate a carrier; and a multiplier with which the first semiconductor portion is provided, the multiplier being configured to avalanche-multiply the carrier generated by the light absorber.

An energy storage device comprising a substrate comprising a series of grooves. Each groove having a first and a second face. Wherein there is a capacitor material in each groove of the series of grooves.

An optoelectronic device including a carrier having a face including flat butt-jointed facets inclined in relation to each other; seeds, mainly made of a first compound selected from the group including the compounds III-V, the compounds II-VI, and the compounds IV, in contact with the carrier in the region of at least some of the joints between the facets; and conical or frustoconical, wire-like three-dimensional semiconductor elements of a nanometric or micrometric size, mainly made of the first compound, on the seeds.

The subject matter of this specification can be embodied in, among other things, a photodetector that includes a semiconductor substrate, a semiconductor annulus on a planar face of the semiconductor substrate, and a metal layer on the semiconductor substrate, wherein the metal layer comprises a first region surrounding the semiconductor annulus and comprises a second region filling an interior region to the semiconductor annulus, and the metal layer in the first region forms a Schottky junction with the semiconductor ring.

Titania is a semiconductor and photocatalyst that is also chemically inert. With its bandgap of 3.0, to activate the photocatalytic property of titania requires light of about 390 nm wavelength, which is in the ultra-violet, where sunlight is very low in intensity. A method and devices are disclosed wherein stress is induced and managed in a thin film of titania in order to shift and lower the bandgap energy into the longer wavelengths that are more abundant in sunlight. Applications of this stress-induced bandgap-shifted titania photocatalytic surface include photoelectrolysis for production of hydrogen gas from water, photovoltaics for production of electricity, and photocatalysis for detoxification and disinfection.

A photodetecting device includes a substrate, an array of sub-pixels, and a lens array covering the array of sub-pixels. Each sub-pixel includes a photosensitive layer supported by the substrate, the photosensitive layer being configured to absorb photons and generate photo-carriers, a first doped portion formed in the photosensitive layer of the respective sub-pixel, wherein the first doped portion includes dopants with a first conductivity type,; and a second doped portion formed in the substrate, wherein the second doped portion includes dopants with a second conductivity type different from the first conductivity type. The array further includes an isolation region separating two or more sub-pixels of the array, a routing layer formed on the substrate configured to electrically couple a circuit to multiple sub-pixels of the array. The lens array includes a spacer portion and a plurality of lenses arranged in a one-to-one correspondence with each of the sub-pixels.

An electronic device includes a solar cell, a wiring board, a connector, a first circuit, a second circuit and a fixing member. The wiring board includes a feeder wiring connected to the solar cell. The connector is continuous with the wiring board and includes a feeder electrode electrically connected to the feeder wiring. The first circuit includes a first electrode and a first wiring continuous with the first electrode. The second circuit includes a second electrode and a second wiring continuous with the second electrode. The fixing member fixes the feeder electrode, the first electrode and the second electrode in a state in which the electrodes are superposed on top of one another, to electrically connect each one of the electrodes to another one or more of the electrodes.