Patent classifications
H01L31/03845
OPTO-ELECTRONIC DEVICE HAVING JUNCTION FIELD-EFFECT TRANSISTOR STRUCTURE AND IMAGE SENSOR INCLUDING THE OPTO-ELECTRONIC DEVICE
Provided is an opto-electronic device having low dark noise and a high signal-to-noise ratio. The opto-electronic device may include: a first semiconductor layer doped to have a first conductivity type; a second semiconductor layer disposed on an upper surface of the first semiconductor layer and doped to have a second conductivity type electrically opposite to the first conductivity type; a transparent matrix layer disposed on an upper surface of the second semiconductor layer; a plurality of quantum dots arranged to be in contact with the transparent matrix layer; and a first electrode provided on a first side of the transparent matrix layer and a second electrode provided on a second side of the transparent matrix layer opposite to the first side, wherein the first electrode and the second electrode are electrically connected to the second semiconductor layer.
INFRARED DETECTOR
Provided is an infrared detector capable of achieving high sensitivity with little noise. An infrared detector includes: contact layers; a photoelectric conversion layer; a barrier layer; and an insertion layer. Each of the contact layers is doped with a dopant. The photoelectric conversion layer is placed between the contact layers, and includes a quantum layer (quantum dots) and an intermediate layer. The barrier layer is placed between the photoelectric conversion layer and one of the contact layers. The insertion layer is placed between, and in contact with, the photoelectric conversion layer and the one contact layer.
SMART SENSOR
A sensor assembly for determining one or more features of a local area is presented herein. The sensor assembly includes a plurality of stacked sensor layers. A first sensor layer of the plurality of stacked sensor layers located on top of the sensor assembly includes an array of pixels. The top sensor layer can be configured to capture one or more images of light reflected from one or more objects in the local area. The sensor assembly further includes one or more sensor layers located beneath the top sensor layer. The one or more sensor layers can be configured to process data related to the captured one or more images. Different sensor architectures featuring various arrangements of memory and computing devices are described, some of which feature in-memory computing. A plurality of sensor assemblies can be integrated into an artificial reality system, e.g., a head-mounted display.
SEPARATE ABSORPTION CHARGE AND MULTIPLICATION AVALANCHE PHOTODIODE STRUCTURE AND METHOD OF MAKING SUCH A STRUCTURE
One illustrative photodiode disclosed herein includes an N-doped anode region, an N-doped impact ionization region positioned above the N-doped anode region and at least one P-doped charge region positioned above the N-doped impact ionization region. In this example, the photodiode also includes a plurality of quantum dots embedded within the at least one P-doped charge region and a P-doped cathode region positioned above the at least one P-doped charge region.
SEPARATE ABSORPTION CHARGE AND MULTIPLICATION AVALANCHE PHOTODIODE STRUCTURE AND METHOD OF MAKING SUCH A STRUCTURE
One illustrative photodiode disclosed herein includes an N-doped anode region, a P-doped cathode region and at least one P-doped charge region positioned laterally between the N-doped anode region and the P-doped cathode region. In this example, the photodiode also includes a plurality of quantum dots embedded within the at least one P-doped charge region and an N-doped impact ionization region positioned laterally between the N-doped anode region and the at least one P-doped charge region.
LIGHT SENSOR AND LIGHT DETECTION SYSTEM
A light sensor includes a photoelectric conversion layer and a long-pass filter that is disposed above the photoelectric conversion layer. The photoelectric conversion layer has a spectral sensitivity characteristic having a first peak at a first wavelength that is longer than a cut-on wavelength of the long-pass filter, and a spectral sensitivity of the photoelectric conversion layer at the cut-on wavelength is greater than or equal to 0% and less than or equal to 50% of a spectral sensitivity of the photoelectric conversion layer at the first wavelength.
INTEGRATED TANDEM SOLAR CELL AND MANUFACTURING METHOD THEREOF
Disclosed herein are a recombination layer containing nanoparticles and an integrated tandem solar cell manufactured using the same. The integrated tandem solar cell includes a first solar cell having a form in which a rear electrode, a light absorption layer, and a buffer layer are stacked, a recombination layer formed on the buffer layer and including a triple layer structure which has first and second transparent conductive layers with a transparent conductive nanoparticle layer disposed therebetween, and a second solar cell disposed on and bonded to the recombination layer and including a perovskite layer.
PRODUCTION OF SILICON NANO-PARTICLES AND USES THEREOF
A process for producing silicon nano-particles from a raw silicon material, the process including steps of alloying the raw silicon material with at least one alloying metal to form an alloy; thereafter, processing the alloy to form alloy nano-particles; and thereafter, distilling the alloying metal from the alloy nano-particles whereby silicon nano-particles are produced.
Production of silicon nano-particles and uses thereof
A process for producing silicon nano-particles from a raw silicon material, the process including steps of alloying the raw silicon material with at least one alloying metal to form an alloy; thereafter, processing the alloy to form alloy nano-particles; and thereafter, distilling the alloying metal from the alloy nano-particles whereby silicon nano-particles are produced.
Opto-electronic device and image sensor including the same
An opto-electronic device includes a base portion, a first electrode and a second electrode formed on an upper surface of the base portion apart from each other, a quantum dot layer, and a bank structure. The quantum dot layer is between the first electrode and the second electrode on the base portion and includes a plurality of quantum dots. The bank structure covers at least partial regions of the first electrode and the second electrode, defines a region where the quantum dot layer is formed, and is formed of an inorganic material.