The present disclosure relates to a semiconductor package, a sensor module, and a production method for dissipating heat generated by a chip. In a solid-state image sensing element package, an image sensing element chip is bonded and fixed to a heat dissipation plate with a die bond material, the heat dissipation plate having positioning holes and mounting holes for accurately mounting on a lens barrel unit. A circuit board is bonded to a bottom surface of the heat dissipation plate with circuit board adhesive resin. Bonding pads that are electrodes of the image sensing element chip are electrically connected to lead terminals that are electrodes of the circuit board by conduction wires through conduction wire connection clearance holes formed through the heat dissipation plate. The present disclosure is applicable to a CMOS solid-state image sensing apparatus used for an image sensing apparatus such as a camera, for example.

A photovoltaic cell may include a hydrogenated amorphous silicon layer including a n-type doped region and a p-type doped region. The n-type doped region may be separated from the p-type doped region by an intrinsic region. The photovoltaic cell may include a front transparent electrode connected to the n-type doped region, and a rear electrode connected to the p-type doped region. The efficiency may be optimized for indoor lighting values by tuning the value of the H2/SiH4 ratio of the hydrogenated amorphous silicon layer.

Systems and methods are presented including solar cells or solar sheets having textured coversheets that provide increased light collection efficiency. Some embodiments include a textured solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The textured solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible, textured solar cells into a component of a UAV, affixing flexible, textured solar cells to a surface of a UAV, or affixing flexible, textured solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

A blocking diode board (“BDB”) for use with a rollable solar power module (“RSPM”) array is disclosed. The DBD includes a blocking diode, first flat electrical conductor, second flat electrical conductor, first tubular hook, and second tubular hook.

The invention provides a suitable method and an appropriate, PV film structure. This aim is achieved by a room temperature method in which aqueous dispersions are printed onto a substrate and cured by an accompanying reaction. The accompanying reaction forms gradients and also nanoscale structures at the film boundaries, which produce a PV active film having standard performance and a higher stability. At around 10% efficiency, stability and no initial loss in performance in the climatic chamber test can be obtained and over a 20 year test period, consistently less fluctuation can be achieved. The method is free from tempering or sintering steps, enables the use of technically pure, advantageous starting materials and makes the PV film structure available as a finished, highly flexible cell for a fraction of the typical investment in production or distribution.

A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.

A polymer substrate and back contact structure for a photovoltaic element, and a photovoltaic element include a CIGS photovoltaic structure, a polymer substrate having a device side at which the photovoltaic element can be located and a back side opposite the device side. A layer of dielectric is optionally formed at the back side of the polymer substrate. A metal structure is formed at the device side of the polymer substrate.

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

A manufacturing method of a thin film solar cell panel includes a step of providing an ultra-thin glass substrate, a step of depositing a first electrode, a photoelectric conversion layer and a second electrode sequentially on the ultra-thin glass substrate, a step of dividing the solar cell panel into a plurality of smaller cell units in series connection through laser scribing respectively after depositing, a step of performing a laser or chemical etching treatment on a cell structure of the solar cell panel, a step of disposing the gate electrode to form the thin film solar cell panel, and a step of performing a bending treatment on the solar cell panel. The manufacturing method of the bendable thin film solar cell panel is improved so as to avoid increase of additional costs, and to greatly increase general applicability onto various bendable thin film solar cell panels.

Methods and systems for forming a layer from a fluid mixture on a web are provided. The system includes a fluid delivery apparatus for delivering the fluid mixture onto the web. The fluid delivery apparatus includes a cascade device and a chemical dispenser device. The system also includes a fluid stirring apparatus comprising at least one fan positioned over the web and configured to generate a flow pattern that stirs the fluid mixture on the web while the layer is being formed, without the at least one fan contacting the fluid mixture. The system further includes a fluid removal apparatus having a rinsing device and a suction device. The rinsing device is configured to dispense a rinsing fluid onto the web. The suction device is configured to remove by suction the rinsing fluid and a remaining portion of the fluid mixture remaining on the web after formation of the layer.