Patent classifications
H01L31/153
Display panel and operation method thereof
A display panel and an operation method thereof are disclosed. In the display panel, a second light-emitting device is configured to emit a second light ray to the non-display side, and a second photosensitive element is configured to allow the second light ray to be incident therein and detect the second light ray. A first light-emitting device and the second light-emitting device are configured to emit a first light ray to the display side, and a first photosensitive element is configured to allow the first light ray reflected by an external object to be incident therein and detect the reflected first light ray. The second light ray is of a type different from that of the first light ray.
Display device
A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface.
Display device
A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface.
HYBRID ELECTRO-OPTICALLY CONTROLLED MATRIX-ADDRESSED SYSTEMS
An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.
HYBRID ELECTRO-OPTICALLY CONTROLLED MATRIX-ADDRESSED SYSTEMS
An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.
LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY PANEL
The present disclosure is related to a light emitting diode. The light emitting diode includes a first transparent electrode layer; a light emitting layer on the first transparent electrode layer; a reflective electrode layer on a surface of the light emitting layer opposite from the first transparent electrode layer, and a second transparent electrode layer. The reflective electrode layer may include transmission hole. The second transparent electrode layer may cover or fill the transmission hole. The transmission hole may be configured to transmit light emitted from the light emitting layer to pass through the second transparent electrode layer.
Semicondutor package structures and methods of manufacturing the same
A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.
Semicondutor package structures and methods of manufacturing the same
A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.
Light reception/emission element module and sensor device
A light reception/emission element module comprises a substrate, a light emitting element disposed on the substrate, a first light receiving device disposed on the substrate apart from the light emitting element, and an upper wall located above the substrate. The upper wall comprises a facing surface facing the light emitting element and the first light receiving element. The light reception/emission element module of the disclosure further comprises a second light emitting element disposed on the substrate. The upper wall further comprises a first light passing portion located above the light emitting element, a second light passing portion located above the second light receiving element, and an intermediate portion located in a region between the first light passing portion and the second light passing portion. At least part of a lower surface of the intermediate portion comprises the facing surface.
High voltage photovoltaics integrated with light emitting diode containing zinc oxide containing layer
An electrical device that includes a material stack present on a supporting substrate. An LED is present in a first end of the material stack having a first set of bandgap materials. A photovoltaic device is present in a second end of the material stack having a second set of bandgap materials. The first end of the material stack being a light receiving end, wherein a widest bandgap material for the first set of bandgap material is greater than a highest bandgap material for the second set of bandgap materials. A zinc oxide interface layer is present between the LED and the photovoltaic device. The zinc oxide layers or can also form a LED.