An electrical device that includes a material stack present on a supporting substrate. An LED is present in a first end of the material stack having a first set of bandgap materials. A photovoltaic device is present in a second end of the material stack having a second set of bandgap materials. The first end of the material stack being a light receiving end, wherein a widest bandgap material for the first set of bandgap material is greater than a highest bandgap material for the second set of bandgap materials. A zinc oxide interface layer is present between the LED and the photovoltaic device. The zinc oxide layers or can also form a LED.

A full-screen image display and an optical assembly thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

A full-screen image display and an optical assembly thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

A portable electronic device and a full-screen image display thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

A portable electronic device and a full-screen image display thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

Embodiments of an improved light-direction detection (LDD) device are described herein. The LDD device includes a substrate and at least one predefined structure formed along the substrate by stacking metal layers, contacts, and vias available in the manufacturing process of the device. The predefined structure is formed along a photodiode pair to collectively define an optical sensor configured to detect direction of incident light without need for off-chip components. The device accommodates light direction detection in two or more orthogonal planes.

A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.

A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.

An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.

An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.