Patent classifications
H01L31/162
Optoelectronic pixel sensor
In some embodiments, an electrical circuit element, defined as optoelectronic pixel, comprises at least one silicon nanowire decorated with optoelectronically active particles and open for contact with a medium for sensing; a metal electrode open for contact with said medium and used for feeding a high-frequency sinusoidal stimulation in impedance measurements and for sensing properties of said medium; implanted source and drain electrodes connected to said silicon nanowire and leaving the gate area and parts of said electrode open for contact with said medium; electrical metal contacts for connecting said pixel to an electrical circuit; and a reference electrode open for contact with said medium for creating a three-electrode-cell system and providing a constant gate potential in the circuit. In addition, some embodiments provide an optoelectronic sensor and wearable-patch sensor based on the array of the optoelectronic pixels, and the readout methods for these sensors.
OPTICAL SENSOR MODULE
An optical sensor including a substrate and a plurality of pixel units are provided. The pixel units are disposed on the substrate, and each of the pixel units includes a light source element, a light sensor element, a circuit unit, and an isolation element. Herein, the light source element emits light, the light sensor element senses an optical image. The circuit unit is configured to drive the light source element to emit light and to drive the light sensor element to sense the optical image. The isolation element isolates the light sensor element from the light source element. In addition, the light source element is disposed between the isolation element of the respective pixel unit and an isolation element of a neighboring pixel unit.
LIGHT EMITTING DEVICE AND LIGHT EMITTING AND RECEIVING DEVICE
A light emitting device including: a light emitting element; a molded resin portion configured to seal at least a portion of the light emitting element; a temperature information acquiring unit configured to acquire temperature information; a humidity information calculating unit configured to calculate humidity information, based on information relating to at least either electrical characteristics or optical characteristics of the light emitting element and the temperature information; and a controlling unit configured to control the light emitting element, based on the temperature information and the humidity information.
LIGHT RECEIVING DEVICE AND LIGHT EMITTING AND RECEIVING DEVICE
A light receiving device including: a light receiving element configured to receive at least a portion of light incident from an outside and output an output signal corresponding to amount of received light; a molded resin portion configured to seal at least a portion of the light receiving element; a temperature information acquiring unit configured to acquire temperature information; a humidity information calculating unit configured to calculate humidity information, based on information relating to at least either electrical characteristics or optical characteristics of the light receiving element and the temperature information; and a compensating unit configured to compensate the output signal, based on the temperature information and the humidity information.
Optical coupling device
An optical coupling device includes a light-emitting element, a light-receiving element that faces the light-emitting element, a lead frame that has a first surface on which the light-emitting element is provided and a second surface facing the first surface, a first covering material that covers the light-emitting element, a second covering material that covers the first covering material, the light-receiving element, and the lead frame, and a third covering material that covers the second covering material. At least one of first bonding strength between the second covering material and the third covering material and second bonding strength between the second covering material and the second surface is lower than third bonding strength between the first covering material and the second covering material.