A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.

An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.

An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter circuit, a detector circuit, a first wire bond, and a second wire bond. The detector circuit is configured to generate a first current in accordance with a first signal. The first wire bond is configured to receive the first current from the transmitter circuit to generate a magnetic flux. The second wire bond is configured to receive the magnetic flux. An induced current in the second wire bond is then detected in the detector circuit. The detector circuit is configured to generate a reproduced first signal, as an output of the detector circuit.

An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter circuit, a detector circuit, a first wire bond, and a second wire bond. The detector circuit is configured to generate a first current in accordance with a first signal. The first wire bond is configured to receive the first current from the transmitter circuit to generate a magnetic flux. The second wire bond is configured to receive the magnetic flux. An induced current in the second wire bond is then detected in the detector circuit. The detector circuit is configured to generate a reproduced first signal, as an output of the detector circuit.

Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.

An optoelectronic semiconductor device includes an epitaxial substrate and a plurality of microsized optoelectronic semiconductor elements. The microsized optoelectronic semiconductor elements are disposed separately and disposed on a surface of the epitaxial substrate. A length of a side of each of the microsized optoelectronic semiconductor elements is between 1 μm and 100 μm, and a minimum interval between two adjacent microsized optoelectronic semiconductor elements is 1 μm.

An optoelectronic semiconductor device includes an epitaxial substrate and a plurality of microsized optoelectronic semiconductor elements. The microsized optoelectronic semiconductor elements are disposed separately and disposed on a surface of the epitaxial substrate. A length of a side of each of the microsized optoelectronic semiconductor elements is between 1 μm and 100 μm, and a minimum interval between two adjacent microsized optoelectronic semiconductor elements is 1 μm.