The present invention discloses a micro-sized face-up LED device with a micro-hole array and preparation method thereof. The LED device is prepared based on a GaN-based epitaxial layer and includes a GaN-based epitaxial layer, a current spreading layer, a P electrode, an N electrode and a passivation layer; the GaN-based epitaxial layer including a substrate, an N-type CaN layer, i.e., an N-GaN layer, a multiple quantum well layer (MQW), and a P-type GaN layer, i.e., a P-GaN layer; and the N-GaN layer including an etched exposed N-GaN layer and an etched formed N-GaN layer. The present invention improves luminescence efficiency while ensuring the device modulation bandwidth; and after the micro-hole array is etched by ICP, a sample continues to be etched by using the current spreading layer etching liquid to prevent the leakage caused by the expansion of the current spreading layer in the etching process.

An engineered wafer includes a plurality of mesa structures that includes a first mesa structure and a second mesa structure. The first mesa structure includes a first porous layer of a first semiconductor material having a first lattice constant, and a first layer of a second semiconductor material on the first porous layer. The first porous layer is characterized by a first porosity. The second semiconductor material is characterized by a second lattice constant greater than the first lattice constant. The second mesa structure includes a second porous layer of the first semiconductor material, and a second layer of the second semiconductor material on the second porous layer. The second porous layer is characterized by a second porosity different from the first porosity. Active regions grown on the first and second layers of the second semiconductor material are configured to emit light of different colors.

A light emitting diode (LED) device includes a substrate and a plurality of mesa structures. Each mesa structure includes a layer of a first semiconductor material, a porous layer of the first semiconductor material on the layer of the first semiconductor material, and a layer of a second semiconductor material on the porous layer. The porous layer is characterized by an areal porosity ≥15%. The second semiconductor material is characterized by a lattice constant greater than a lattice constant of the first semiconductor material. Each mesa structure also includes an active region on the layer of the second semiconductor material and configured to emit red light, a p-contact layer on the active region, a dielectric layer on sidewalls of the p-contact layer and the active region, and an n-contact layer in physical contact with at least a portion of sidewalls of the layer of the second semiconductor material.

A process for manufacturing an optoelectronic device having a diode matrix with semiconductor stacks involves providing a growth substrate having a support substrate coated with a nucleation layer defining a nucleation surface. A dielectric layer is deposited on the nucleation surface. A plurality of through-holes, extending to the nucleation surface, are formed in the dielectric layer. The nucleation layer, located in the through-holes, is etched to free up an upper surface of the support surface and expose a lateral surface of the nucleation layer forming a lateral nucleation surface. A dielectric region is formed extending in the support substrate such that, during a subsequent epitaxial growth stage, each first doped portion is formed especially from the lateral nucleation surface. In the through-holes and from the nucleation surface, the semiconductor stacks are epitaxially grown such that at least the first doped portions and active zones thereof are located in the through-holes.

A method for producing an optoelectronic device having nitride-based microLEDs includes providing an assembly having at least one growth substrate and a nitride structure, where the nitride structure has a semipolar nitride layer that includes an active stack and crystallites extending from facets of the growth substrate with a crystalline orientation {111} to the first face of the semipolar nitride layer and providing an integrated control circuit featuring electric connection pads. The assembly is placed on the integrated control circuit, the growth substrate and the crystallites are removed, and trenches are formed in the stack so as to delimit a plurality of islets, each islet being configured to form a microLED.

It is provided a seed crystal layer, composed of a group 13 nitride crystal selected from gallium nitride, aluminum nitride, indium nitride or the mixed crystals thereof, on an alumina layer on a single crystal substrate. By annealing under reducing atmosphere at a temperature of 950° C. or higher and 1200° C. or lower, convex-concave morphology is formed on a surface of the seed crystal layer so as to have an RMS value of 180 nm to 700 nm measured by an atomic force microscope. On the surface of the seed crystal layer, it is grown a group 13 nitride crystal layer composed of a group 13 nitride crystal selected from gallium nitride, aluminum nitride, indium nitride or the mixed crystals thereof.

The inventive concept relates to a light emitting diode integrated with a transition metal dichalcogenide-based transistor and capable of simultaneously fabricating the transistor to have a monolithic integration structure. The transition metal dichalcogenide is formed on the light emitting diode device, thereby providing the light emitting diode integrated with the transistor without affecting the characteristics of the light emitting diode device.

A nitride semiconductor light emitting element includes: an n-side nitride semiconductor layer; a p-side nitride semiconductor layer; and an active layer disposed between the n-side nitride semiconductor layer and the p-side nitride semiconductor layer and comprising a plurality of stacks, each comprising a well layer and a barrier layer. The well layers include, successively from the n-side nitride semiconductor layer side, a first well layer, a second well layer, and a third well layer that is positioned closest to the p-side nitride semiconductor layer among the well layers. A thickness of the second well layer is greater than a thickness of the first well layer. A thickness of the third well layer is greater than the thickness of the second well layer. Among the barrier layers, the first barrier layer, which is positioned between the third well layer and the p-side nitride semiconductor layer, is doped with a p-type impurity.

A method for manufacturing a light-emitting element includes: providing a semiconductor stacked body including a first semiconductor layer, an active layer, and a second semiconductor layer, formed in this order on a substrate; exposing a surface of the first semiconductor layer by removing the substrate; and forming a protective film on the surface of the first semiconductor layer by performing steps including: forming a first layer on the surface of the first semiconductor layer by chemical vapor deposition while introducing a source gas to a film formation chamber at a first flow rate, and forming a second layer on the first layer by chemical vapor deposition while introducing a source gas to the film formation chamber at a second flow rate, the second flow rate being less than the first flow rate.

A method for manufacturing a light emitting element includes forming a first semiconductor layer on a substrate, the first semiconductor layer including a semiconductor of a first type; forming an active layer on the first semiconductor layer; forming a second semiconductor layer on the active layer, the second semiconductor layer including a semiconductor of a second type different from the first type; performing an etching process of removing at least a portion of each of the first semiconductor layer, the active layer, and the second semiconductor layer in a direction toward the first semiconductor layer from the second semiconductor layer; and forming a first insulating layer to surround an outer surface of the active layer. The first insulating layer is formed by a wet process.