A method of manufacturing an electronic device according to the present invention, comprises: preparing a substrate; forming an n-type semiconductor including a III-V compound semiconductor or a II-VI compound semiconductor material on the substrate; forming a metal thin film including at least one of copper (Cu), silver (Ag), gold (Au), titanium (Ti), and nickel (Ni) on the n-type semiconductor; and forming a p-type semiconductor on the n-type semiconductor by iodinizing the metal thin film using any one of liquid iodine (I), solid iodine (I), and gas iodine (I). Therefore, it is possible to overcome the limitation of the light emission efficiency of the p-type semiconductor by providing a hybrid type electronic device and a manufacturing method.

A method of manufacturing a nitride semiconductor light emitting element includes: growing an n-side nitride semiconductor layer; growing an active layer on the n-side nitride semiconductor layer; and growing a p-side nitride semiconductor layer on the active layer, which includes: growing a first p-side nitride semiconductor layer, growing a second p-side nitride semiconductor layer, growing a third p-side nitride semiconductor layer, and growing a fourth p-side nitride semiconductor layer, while varying flow rates of an Al source gas, a Ga source gas, an N source gas, and a Mg source gas.

A light-emitting package, includes: a housing including an opening; a lead frame covered by the housing; a light-emitting device, mounted in the opening and electrically connected to the lead frame, the light-emitting device including: a substrate including: a base with a main surface; and a plurality of protrusions on the main surface, wherein the protrusion and the base include different materials; a semiconductor stack on the main surface, the semiconductor stack including a side wall, and wherein an included angle between the side wall and the main surface is an obtuse angle; wherein the main surface includes a peripheral area not covered by the semiconductor stack, and the peripheral area is devoid of the protrusion formed thereon; and a filling material filling in the opening and covering the light-emitting device.

A micro-light emitting diode (uLED) device comprises: a mesa comprising: a plurality of semiconductor layers including an n-type layer, an active layer, and a p-type layer; a p-contact layer contacting the p-type layer; a cathode contacting the first sidewall of the n-type layer; a first region of dielectric material that insulates the p-contact layer, the active layer, and a first sidewall of the p-type layer from the cathode; an anode contacting the top surface of the p-contact layer; and a second region of dielectric material that insulates the active layer, a second sidewall of the p-type layer, and the second sidewall of the n-type layer from the anode. The top surface of the p-contact layer has a different planar orientation compared to the first and second sidewalls of the n-type layer. Methods of making and using the uLED devices are also provided.

A display device, a light-emitting element, and a method of manufacturing a light-emitting element are provided. A display device includes: a first electrode and a second electrode spaced apart from each other; and light-emitting elements between the first electrode and the second electrode, and each of the light-emitting elements includes a first area having a first diameter, a second area having a second diameter greater than the first diameter, a first insulating film surrounding the first area, and a second insulating film on the first insulating film, and the second insulating film surrounds the second area exposed by the first insulating film.

An image display element, provided with a pixel region and a connection region, includes a light-emitting unit and a driving circuit substrate. The light-emitting unit includes a semiconductor layer obtained by layering a second conductive layer, a light-emitting layer, and a first conductive layer, mesa shapes formed by dividing the semiconductor layer, and a step portion separated from the mesa shapes by a groove. A first electrode is connected to the first conductive layer and a first driving electrode. The light-emitting unit further includes, between the mesa shapes adjacent to each other, a wiring line layer forming a conductive path, the wiring line layer being thinner than a layer thickness of a portion of each of the mesa shapes in the semiconductor layer. The wiring line layer extends to a top of the step portion and is connected to a common second electrode provided on the step portion.

InGaN/GaN quantum layer nanowire light emitting diodes are fabricated into a single cluster capable of exhibiting a wide spectral output range. The nanowires having InGaN/GaN quantum layers formed of quantum dots are tuned to different output wavelengths using different nanowire diameters, for example, to achieve a full spectral output range covering the entire visible spectrum for display applications. The entire cluster is formed using a monolithically integrated fabrication technique that employs a single-step selective area epitaxy growth.

A gallium nitride (GaN) based light emitting diode (LED), wherein light is extracted through a nitrogen face (N-face) of the LED and a surface of the N-face is roughened into one or more hexagonal shaped cones. The roughened surface reduces light reflections occurring repeatedly inside the LED, and thus extracts more light out of the LED. The surface of the N-face is roughened by an anisotropic etching, which may comprise a dry etching or a photo-enhanced chemical (PEC) etching.

Epitaxial lateral overgrowth (ELO) III-nitride layers are grown on or above an opening area of a growth restrict mask deposited on a substrate, wherein the growth of the ELO III-nitride layers and/or a subsequent regrowth layer form one or more voids. III-nitride device layers are grown on or above the ELO III-nitride layers and/or regrowth layer. Stress is applied to a breaking point at the substrate, with the voids assisting the application of stress, so that a bar of devices comprised of the III-nitride device layers, the ELO III-nitride layers and the regrowth layer is removed from the substrate. The voids release stress from the growth restrict mask, which helps prevent cracks. Decomposition of the growth restrict mask is avoided to prevent compensation of p-type layers.

A patterned substrate includes a substrate body having a surface and a plurality of patterned structures periodically arranged on the surface of the substrate body, where each of the patterned structures includes a first portion formed on the surface of the substrate body, and a second portion formed on the first portion, and where any two adjacent ones of the patterned structures are spaced apart from one another by a minimum distance of not greater than 0.1 μm. A light-emitting diode includes the patterned substrate and a semiconductor epitaxial structure formed thereon. A process for preparing the patterned substrate and a process for preparing the light-emitting diode are also disclosed.