A tiled display device includes a first display substrate including a plurality of light emitting areas defined by one or more banks, a second display substrate adjacent to the first display substrate and including a plurality of light emitting areas, a coupling member coupling the first display substrate and the second display substrate, and a color conversion substrate including a plurality of light transmitting areas corresponding to the plurality of light emitting areas of each of the first display substrate and the second display substrate, and a plurality of light blocking areas between the plurality of light transmitting areas and corresponding to the one or more banks or the coupling member.

The present invention provides a luminous body, and light emitting film, light emitting diode and light emitting device including the same. The luminous body can include a plurality of emission moieties each including an inorganic emission particle and a coating layer surrounding a surface of the inorganic emission particle, and an encapsulation moiety connected to the coating layer and surrounding the plurality of emission moieties. The present invention further provides a light emitting film, a liquid crystal display device, a light emitting diode package, a light emitting diode and a light emitting display device including the luminous body.

A light emitting material includes: luminescent nanoparticles; and an ionic crystal containing an anionic component represented by formula (1) below. In the formula, R.sup.1 and R.sup.2 each independently denote a fluorine atom or a fluoroalkyl group, or R.sup.1 and R.sup.2 each denote a fluoroalkylene group to be connected to each other to form a ring. ##STR00001##

A β-sialon phosphor that is a solid solution of europium, in which D.sub.50 is 7.0 μm or more and 20.0 μm or less and (D.sub.50−D.sub.10)/D.sub.50 is 0.60 or less, where D.sub.50 is a 50% area diameter of primary particles of the β-sialon phosphor, and D.sub.10 is a 10% area diameter of the primary particles of the β-sialon phosphor. Primary particles are defined as single-crystal particles distinguished for each crystal orientation by identifying the crystal orientation of individual particles of the β-sialon phosphor by an electron backscatter diffraction image method. D.sub.50 and D.sub.10 are obtained by image analysis of the cross-sectional area of the primary particles.

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.

A display device includes a bank including an opening defining a plurality of pixels; a plurality of light emitting elements disposed in the plurality of pixels; a color conversion layer disposed on the plurality of light emitting elements in the opening; and a low refractive layer disposed on the color conversion layer in the opening.

A method of manufacturing an electronic component including a substrate is provided. The method includes generating a plasma remote from a sputter target, generating sputtered material from the sputter target using the plasma, and depositing the sputtered material on a substrate as a crystalline layer.

A light emitting device includes: a base member having a first surface including a first region; a first electric terminal including a first pin hole, the first pin hole penetrating the base member along a thickness direction of the base member; a second electric terminal including a second pin hole, the second pin hole penetrating the base member along the thickness direction; a first frame provided on the base member and surrounding the first region; a plurality of light emitting elements provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the plurality of light emitting elements; and a protective element positioned between the base member and the first frame in the thickness direction. When viewed in a direction from the first pin hole toward the second pin hole, the protective element is positioned between the plurality of light emitting elements and the first pin hole and between the plurality of light emitting elements and the second pin hole.

A pixel may include first and second electrodes spaced apart from each other along a first direction, first light emitting elements arranged along a second direction in a first area between the first electrode and the second electrode, and including a first end portion adjacent to the first electrode and a second end portion adjacent to the second electrode, a first contact electrode on the first end portions of the first light emitting elements, and including a transparent electrode layer, a second contact electrode on the second end portions of the first light emitting elements, and including a reflective electrode layer, a first bank pattern overlapping a portion of the first electrode beneath the first electrode, and a second bank pattern overlapping a portion of the second electrode beneath the second electrode, wherein the first and second bank patterns are spaced apart from the first area by different distances.

The present disclosure provides an electronic device including a driving circuit substrate, a plurality of chips, and a passivation layer. The driving circuit substrate includes a plurality of active elements. The chips are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate. The passivation layer covers the plurality of chips and the driving circuit substrate. The passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part. The first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.