A method of aligning micro light emitting elements includes supplying the plurality of micro light emitting elements on a substrate including a plurality of grooves having different shapes, the plurality of micro light emitting elements being configured to be inserted exclusively and respectively into the plurality of grooves; respectively inserting the plurality of micro light emitting elements into the plurality of grooves; and aligning the plurality of micro light emitting elements, wherein at least one groove of the plurality of grooves has a shape that is different from a shape of a respective micro light emitting element inserted into the at least one groove.

A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

The present invention is directed to a technique for visually judging an exchange timing of a container which has been heated in the air and thus degraded. The container is a container having a storage section for storing products: wherein the constituent material of the container is a resin composition; wherein the composition contains an antistatic agent; wherein the composition contains no coloring material, or contains a coloring material, however in this case, at a time when (a surface electric resistance value of the container having been changed by heating of the container)/(a surface electric resistance value of the container at a time of starting the heating)=10, discoloration of the container caused by the heating is a recognizable degree; and wherein the container is exchanged in a case where the container is discolored to a defined color by the heating.

Implementations of a semiconductor device may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The first largest planar surface, the second largest planar surface, and the thickness may be formed by at least two semiconductor die. The warpage of one of the first largest planar surface or the second largest planar surface may be less than 200 microns.

A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.

A method includes forming a semiconductor device comprising a semiconductor die surrounded by a molding material, wherein a contact metal of the semiconductor device has an exposed edge, placing the semiconductor device into a tray having an inner wall and an outer wall, wherein the inner wall is underneath the semiconductor device and between an outer edge of the semiconductor device and an outer edge of bumps of the semiconductor device, depositing a metal shielding layer on the semiconductor device and the tray, wherein the metal shielding layer is in direct contact with the exposed edge of the contact metal and separating the semiconductor device from the tray.

A method for manufacturing an interposer board without a feature layer structure according to an embodiment of the present invention may include preparing a temporary carrier; forming an edge seal for the temporary carrier; laminating an insulating material onto upper and lower surfaces of the temporary carrier to form an insulating layer; forming a via on the insulating layer, filling the via with a metal; and removing the edge seal and removing the temporary carrier. An interposer board without a feature layer structure according to an embodiment of the present invention may include an insulating layer and a via-post layer embedded in the insulating layer, wherein the via-post has an end used as a pad.

An apparatus including a carrier mount having a staircase of steps in an opening in the carrier mount and a plurality of dies, each one of the dies having at least a portion of an edge of a major surface thereof located on one of the steps corresponding to the one of the dies such that the dies form a stack, major surfaces of the dies being substantially parallel in the stack, each of the dies having one or more electro-optical devices thereon.

According to one embodiment, a method of manufacturing a display device is provided. The display device includes a mounting substrate and a plurality of light-emitting elements two-dimensionally arrayed and mounted on the mounting substrate. The plurality of light-emitting elements have a planar shape that is non-rotationally symmetric and non-linearly symmetric. The method includes preparing the plurality of light-emitting elements separated from each other, preparing an array guide member, and aligning the plurality of light-emitting elements following the two-dimensional array of the opening portion group.