H01L2223/54446

Method of manufacturing semiconductor device and structure with trenches in passivation film
09553217 · 2017-01-24 · ·

A method of manufacturing a semiconductor device is provided. The method includes forming a passivation film on a substrate including a first element region, a second element region adjacent to the first element region in a first direction, a third element region adjacent to the first region in a second direction, and a first scribe region extending to the first direction between the first element region and the third element region, forming a first trench in the passivation film between the first scribe region and the first element region, forming a second trench in the passivation film between the third element region and the first scribe region, and forming a film on the passivation film where the trenches have been formed by coating. The each of trenches is formed continuously along the first and the second element region.

SYSTEMS AND METHODS FOR SOLAR PANEL TRACKING

Solar panels may have manufacturing defects that warrant a recall by solar panel manufacturers. Given the large quantity of solar panels in a solar farm, it is challenging to identify and track those panels affected by the recall. The present invention describes system and method embodiments for solar panel tracking for the convenience of solar panel service or replacement. Panel identifiers of solar panels in a solar table installed on an installation site of a solar farm are scanned such that the panel identifiers of the solar panels may be associated with the geographical information at the installation site. A geographical database for solar panels may be created and updated, with each panel having an entry of panel information and geographical information. When a recall is issued, involved solar panels in the solar farm may be quickly and accurately identified using the geographical database.