In an example, a communication module such as an optoelectronic communication module may include an integrated circuit (IC), an electrical interconnect, and an interposer circuit. The electrical interconnect may include a radio frequency (RF) interconnect or a direct current (DC) interconnect. The interposer circuit may be electrically coupled between the IC and the electrical interconnect.

A terahertz device includes a terahertz element, a sealing resin, a wiring layer and a frame-shaped member. The terahertz element that performs conversion between terahertz waves and electric energy. The terahertz element has an element front surface and an element back surface spaced apart from each other in a first direction. The sealing resin covers the terahertz element. The wiring layer is electrically connected to the terahertz element. A frame-shaped member is made of a conductive material and arranged around the terahertz element as viewed in the first direction. The frame-shaped member has a reflective surface capable of reflecting the terahertz waves.

A controllable frequency selective surface. The frequency selective surface has a plurality of conductive patches with integrated circuits straddling gaps between, and connected to, pairs of patches separated by gaps. Each integrated circuit presents a controllable impedance and as a result the characteristics of the frequency selective surface are controllable.

The coaxial cable assembly generally has a coaxial cable; and a connector assembled to an end of the coaxial cable, the connector having a dielectric body having a connecting surface, a longitudinal groove recessed in the connecting surface and having a groove end spaced from an edge of the connecting surface, and a coplanar waveguide along the connecting surface, the coplanar waveguide having a signal conductor extending from the groove end to the edge and between ground conductors each extending from a respective lateral side of the longitudinal groove to the edge; the end of the coaxial cable being received in the longitudinal groove and having an inner conductor electrically connected to the signal conductor and an outer conductor electrically connected to the ground conductors in a manner allowing connection of the coaxial cable with another coplanar waveguide of an integrated circuit.

A controllable frequency selective surface. The frequency selective surface has a plurality of conductive patches with integrated circuits straddling gaps between, and connected to, pairs of patches separated by gaps. Each integrated circuit presents a controllable impedance and as a result the characteristics of the frequency selective surface are controllable.

A semiconductor device includes an optical connector element and an optical coupler. The optical connector element includes a base structure, a first polymer via and a cladding layer. The base structure has a first surface and a second surface opposite to the first surface. The first polymer via passes through the base structure from the first surface to the second surface. The cladding layer is surrounding the first polymer via, wherein a refractive index of the cladding layer is different than a refractive index of the first polymer via. The optical coupler is disposed over the optical connector element, wherein the optical coupler receives optical signals from the first polymer via.

A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from the mounting surface.