In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.

A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.

The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.