A semiconductor device has a substrate and a semiconductor package disposed over the substrate. An embedded bar (e-bar) substrate is disposed on the substrate around the semiconductor package. A heat sink is formed over the semiconductor package and supported by the e-bar substrate to elevate the heat sink from the substrate and reduce a thickness of the heat sink. A thermal interface material is deposited between the semiconductor package and heat sink. Alternatively, a shield layer can be formed over the semiconductor package and supported by the e-bar substrate. The e-bar substrate has a base layer and a first metal layer formed over a first surface of the base layer. A bump is formed over the first metal layer. A second metal layer can be over a second surface of the base layer opposite the first surface of the base layer. Two or more e-bar substrates can be stacked.

A chip package assembly and method for fabricating the same are provided which utilize a plurality of extra-die heat transfer posts for improved thermal management. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate, a cover disposed over the first IC die, and a plurality of extra-die conductive posts disposed between the cover and substrate. The extra-die conductive posts provide a heat transfer path between the cover and substrate that is laterally outward of the first IC die.

A sensor element is disclosed. In an embodiment a sensor element includes a substrate, a light emitting semiconductor chip arranged with a mounting face on a mounting face of the substrate, wherein the semiconductor chip has a smaller mounting face than the substrate, wherein a border area of the mounting face of the substrate circumvents the semiconductor chip, wherein on a bottom side of the semiconductor chip electrical contacts are arranged, and wherein the substrate is transparent for radiation of the semiconductor chip, a carrier, wherein the bottom side of the semiconductor chip is arranged on a mounting face of the carrier, wherein the carrier includes further electrical contacts on the mounting face, and wherein the contacts of the semiconductor chip and the further contacts of the carrier are connected, a sealing member arranged between the mounting face of the carrier and the border area of the substrate, wherein the sealing member seals a sealing area between the substrate and the carrier, wherein a recess is arranged in the mounting face of the carrier, and an optical sensor arranged in the recess.

A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.

An electronic device package includes a frame, an electronic device mounted to the frame, surface-mount leads, and a gel at least partially filling a cavity between the electronic device and the frame. The electronic device includes electronic circuitry provided on an electronic device substrate, and the surface-mount leads are electrically connected to the electronic circuitry and extend laterally and outwardly from an outer perimeter of the frame. The gel in the cavity covers the electronic circuitry.

An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.

A semiconductor device includes a substrate, which further includes a cavity and a trench extended from the cavity. The semiconductor includes a first chip and a second chip on the substrate, a bridge chip interconnecting between the first and second chips and residing in the cavity, and underfill material filling the cavity and the trench, and surrounding the bridge chip.

A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0?<?<90? wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.