An electronic device may include a dielectric substrate and bond wire pads on an upper surface thereof. The electronic device may also include a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate and bond wires coupling the RF IC to respective bond wire pads. The electronic device may also include a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the bond wires, and a thermosetting polymer layer over the rigid dielectric lid.

A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level. After assembling the components, joining connections at the first and second joining levels may be completed by a temperature or pressure based joining process.

An electronic module 1 includes an electronic module 10 that includes a substrate 11 and an electronic element 12, an electronic module 20 that includes a substrate 21 arranged such that the principal surface 21a faces the principal surface 11a, an electronic element 22 electrically connected to the electronic element 12 with a connecting member 18 therebetween, and an electronic element 23 electrically connected to the electronic element 12 with a connecting member 19 therebetween passing through the substrate 21 in a thickness direction, the electronic module 20 thermally connected to the electronic module 10 by the connecting members 18 and 19, and a heat sink 30 that includes a housing part 31a therein and houses the electronic modules 10 and 20 in the housing part 31a such that the principal surface 11b is in contact with an inner wall surface of the housing part 31a.

A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.