The invention relates to a cover structure, an SMC mold as well as a method for producing a cover structure having an SMC main body which is pressed together with a flame retardant coating in an SMC mold.

A secondary battery including: a case including an opening; a top cover assembly including a top cover plate covering the opening and an electrode terminal, the top cover plate including an electrode lead-out hole corresponding to the electrode terminal; an electrode assembly received in the case and including a main body and a tab, the tab being bent relative to a thickness direction of the top cover plate to form a bent portion; and a current collecting wiring board disposed between the top cover plate and the main body and including a first connection portion, a second connection portion, and a transition portion, the first connection portion and the second connection portion extending along a width direction of the top cover plate and being provided opposite to each other, the first connection portion being connected with the electrode terminal, and the second connection portion being connected with the bent portion.

A secondary battery including: a case including an opening; a top cover assembly including a top cover plate covering the opening and an electrode terminal, the top cover plate including an electrode lead-out hole corresponding to the electrode terminal; an electrode assembly received in the case and including a main body and a tab, the tab being bent relative to a thickness direction of the top cover plate to form a bent portion; and a current collecting wiring board disposed between the top cover plate and the main body and including a first connection portion, a second connection portion, and a transition portion, the first connection portion and the second connection portion extending along a width direction of the top cover plate and being provided opposite to each other, the first connection portion being connected with the electrode terminal, and the second connection portion being connected with the bent portion.

In a sealed power storage device, a device case includes a resin case body with an opening and a resin lid closing the opening. The resin lid is made of electrical insulation resin. A metal terminal member is extended from inside to outside of the device case, penetrating through the resin lid. The resin lid is hermetically molded together with the metal terminal member so that the resin lid is directly joined to the outer peripheral surface of the metal terminal member without interposing another member between the resin lid and the metal terminal member.

In a sealed power storage device, a device case includes a resin case body with an opening and a resin lid closing the opening. The resin lid is made of electrical insulation resin. A metal terminal member is extended from inside to outside of the device case, penetrating through the resin lid. The resin lid is hermetically molded together with the metal terminal member so that the resin lid is directly joined to the outer peripheral surface of the metal terminal member without interposing another member between the resin lid and the metal terminal member.

Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.

Provided is a method for manufacturing an energy storage device. In the method of manufacturing an energy storage device, a lid assembly is formed by integrating a lid plate covering an opening of a case which houses a plate, an external terminal exposed to outside of the lid plate, and a conductive plate portion disposed inside the lid plate in an overlapping manner. The lid assembly is disposed between a vibrating jig and a receiving jig, a tab of the plate is disposed between the conductive plate portion and the vibrating jig, and ultrasonic welding is applied to the tab and the conductive plate portion.

This application provides a secondary battery, a battery module, and a device using a secondary battery as a power supply. The secondary battery includes an electrode assembly, a cap assembly, and current collection members. The electrode assembly includes a main body and tabs that extend from the main body. The cap assembly includes a cap plate, electrode terminals, and an insulation baffle. The electrode terminals are disposed on the cap plate. The insulation baffle is connected to a side of the cap plate, where the side is close to the main body. The current collection members are at least partly located between the insulation baffle and the main body, and each of the current collection members includes a tab connection portion connected to one of the tabs. The insulation baffle contains a first recess.

A battery cell stack casing includes casing walls defining a housing interior for receiving a battery cell stack; a first end plate provided between the walls at a first end of the casing to close a first end of the housing interior. The casing also include a second end plate provided between the walls at a second end of the casing to close a second end of the housing interior. The casing walls have a multi-layer structure include: an inner layer having a first side facing into the housing interior and a second opposite side; an outer layer spaced outwardly from the second side of the inner layer; a thermally insulating volume defined between the second side of the inner layer and the outer layer, the thermally insulating material containing a low density thermally insulative material e.g., foam or other insulative material; and a layer of intumescent material provided on the first side of the inner layer.

Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.