Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.

The present invention provides a small-sized filter which has good characteristics. A filter according to the present invention comprises: a resonator which has a via electrode part that is formed within a dielectric substrate and a first strip line that is connected to one end of the via electrode part, while facing a first shielding conductor among a plurality of shielding conductors that are formed so as to surround the via electrode part; an input/output terminal which is coupled to a second shielding conductor among the plurality of shielding conductors; and a first capacitor electrode pattern which is coupled to the input/output terminal. The first capacitor electrode pattern is capacitively coupled to the first strip line or a second capacitor electrode pattern that is connected to the via electrode part.

The present disclosure provides a bandpass filter based on effective localized surface plasmons (ELSPs) and an operation method thereof. The bandpass filter includes a metal ground plane on a lower portion and a dielectric substrate in a middle as well as microstrips and dielectric resonators on an upper portion, where the microstrips at two terminals are symmetric with each other; each dielectric resonator includes a cuboid dielectric body and two metal strips, where the two metal strips each the same as the cuboid dielectric body in length are respectively located in a middle of an upper surface and lower surface of the dielectric body; and two microstrips are respectively connected to the metal strips on lower surfaces of two dielectric resonators, so as to be used as ports for feeding.

A radio frequency filter module includes: an antenna package including patch antennas and having first and second frequency passbands different from each other; an integrated circuit (IC) package including an IC; and a connecting member disposed between the antenna package and the IC package, and having a laminated structure configured to electrically connect the patch antennas and the IC to each other. The connecting member includes: a first radio frequency filter pattern having the first and second frequency passbands, and including a first port electrically connected to the IC and a second port electrically connected to at least one of the patch antennas; and a second radio frequency filter pattern having the first and second frequency passbands, and including a third port electrically connected to the IC and a fourth port electrically connected to at least another one of the patch antennas.

Transmission-line filtering with enhanced frequency response is disclosed. In an example aspect, an apparatus includes a transmission-line filter to enhance a frequency response of a filtering operation. The transmission-line filter includes an input port, an output port, and multiple transmission-line base units. The multiple transmission-line base units are disposed between the input port and the output port and are coupled to the input port and the output port. Each of the multiple transmission-line base units includes a respective transmission line of multiple transmission lines. At least one transmission-line base unit of the multiple transmission-line base units includes a multi-resonant circuit.

A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

A band-pass filter includes first to sixth stage resonators. Each resonator includes a resonator conductor portion formed of a conductor line. The resonator conductor portion has a first end and a second end which are opposite ends of the conductor line. The resonator conductor portion of each of the first and sixth stage resonators includes a narrow portion, a first wide portion located between the narrow portion and the first end, and a second wide portion located between the narrow portion and the second end. Each of the first and sixth stage resonators is lower in unloaded Q than the other resonators.

Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.

An electromagnetic field band-stop filter includes a plurality of unit structures that have reflection characteristics on an electromagnetic wave of a predetermined frequency. Each of the plurality of unit structures includes: a plurality of electrode parts each of which is disposed along a side of a polygon in a non-contact manner with another electrode part; and a plurality of conductor parts which are provided for the plurality of electrode parts on a one-to-one basis and each of which has at least one bent portion between one end and other end, the one ends of the plurality of conductor parts being connected to the electrode parts on a one-to-one basis and the other ends of the plurality of conductor parts being connected at one point on an inner side of the electrode parts in the individual unit structure. The plurality of unit structures are regularly and two-dimensionally disposed by disposing electrode parts of the plurality of unit structures to be adjacent to each other with a spacing that reflects the predetermined frequency.

A technology for a dual-common port multi-bandpass filter is described. The dual-common port multi-bandpass filter can include two or more analog filters. The dual-common port multi-bandpass filter can include a first common port coupled to an input of each of the two or more analog filters, where each analog filter can be configured to filter one or more frequency bands. The dual-common port multi-bandpass filter can include a second common port coupled to an output of each of the two or more analog filters. Each input of each of the two or more analog filters can be impedance matched with the first common port. Each output of each of the two or more analog filters can be impedance matched with the second common port.