H01P1/20327

Band pass filter including microstrip transmission line

A band pass filter including a microstrip transmission line comprises: a substrate having a grounding surface formed on a rear surface thereof; an input port which is formed on an upper surface of the substrate and receives a transmission signal; an output port which is formed on the upper surface of the substrate and outputs a filtered transmission signal; and a plurality of signal transmission lines spaced at predetermined distance from one another in parallel, each of the plurality of signal transmission lines having one end connected to and in contact with the input port, and having the other end connected to and in contact with the output port.

CRYOGENIC ON-CHIP MICROWAVE FILTER FOR QUANTUM DEVICES

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

RADIO FREQUENCY FILTER AND RADIO FREQUENCY MODULE

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Cryogenic on-chip microwave filter for quantum devices

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

Radio frequency filter and radio frequency module

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Band-pass filter

A band-pass filter includes five resonators. The five resonators are configured so that capacitive coupling is established between every two of the resonators adjacent to each other in circuit configuration. The first stage resonator and the fifth stage resonator are magnetically coupled to each other. The second stage resonator and the fourth stage resonator are capacitively coupled to each other. Each of the five resonators includes a resonator conductor portion. The respective resonator conductor portions of the first and fifth stage resonators are physically adjacent to each other. The respective resonator conductor portions of the second and fourth stage resonators are physically adjacent to each other. The respective resonator conductor portions of the first and second stage resonators are physically adjacent to each other. The respective resonator conductor portions of the fourth and fifth stage resonators are physically adjacent to each other.

RADIO FREQUENCY FILTER MODULE

A radio frequency filter module includes: an antenna package including patch antennas and having first and second frequency passbands different from each other; an integrated circuit (IC) package including an IC; and a connecting member disposed between the antenna package and the IC package, and having a laminated structure configured to electrically connect the patch antennas and the IC to each other. The connecting member includes: a first radio frequency filter pattern having the first and second frequency passbands, and including a first port electrically connected to the IC and a second port electrically connected to at least one of the patch antennas; and a second radio frequency filter pattern having the first and second frequency passbands, and including a third port electrically connected to the IC and a fourth port electrically connected to at least another one of the patch antennas.

Filter comprising printed circuit board and busbars

A filter for electromagnetic noise comprising: a printed circuit board (5) having conductor tracks, having a first side and having a second side opposite the first side; a first busbar (1), which is secured on the first side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks; and a second busbar (2), which is secured on the second side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks. The printed circuit board (5) is arranged between the first busbar (1) and the second busbar (2) for the insulation thereof.

Filter comprising printed circuit board and busbars

A filter for electromagnetic noise comprising: a printed circuit board (5) having conductor tracks, having a first side and having a second side opposite the first side; a first busbar (1), which is secured on the first side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks; and a second busbar (2), which is secured on the second side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks. The printed circuit board (5) is arranged between the first busbar (1) and the second busbar (2) for the insulation thereof.

BAND PASS FILTER INCLUDING MICROSTRIP TRANSMISSION LINE
20200144689 · 2020-05-07 ·

A band pass filter including a microstrip transmission line comprises: a substrate having a grounding surface formed on a rear surface thereof; an input port which is formed on an upper surface of the substrate and receives a transmission signal; an output port which is formed on the upper surface of the substrate and outputs a filtered transmission signal; and a plurality of signal transmission lines spaced at predetermined distance from one another in parallel, each of the plurality of signal transmission lines having one end connected to and in contact with the input port, and having the other end connected to and in contact with the output port.