A filtering power divider includes a first partial transmission line having a first electrical length, a second partial transmission line having a second electrical length, and a third partial transmission line having the second electrical length. The first, second, and third partial transmission lines connect to form a T-junction, and a sum of the first and second electrical lengths is ninety degrees. Thus, the first and second partial transmission lines cooperate to act as a quarter-wave transmission line. Similarly, the first and third partial transmission lines cooperate to act as a quarter-wave transmission line. Additional transmission lines may be connected to the first, second, and third partial transmission lines to implement a filter between an input port and each of two output ports.

A filter device (130) is formed between an input end (T1) and an output end (T2), and is configured to attenuate a radio frequency signal in a specific frequency band. The filter device (130) includes a dielectric substrate (140) having a multilayer structure, ground electrodes (GND1 and GND2) formed in the dielectric substrate (140), a first coupling line (132) electrically connected to the input end (T1), a second coupling line (134) electrically connected to the output end (T2), and a stub (133) connected to the first coupling line (132) and the second coupling line (134). The first coupling line (132) and the second coupling line (134) are formed in layers different from layers of the ground electrodes (GND1 and GND2). The first coupling line (132) and the second coupling line (134) are disposed in different layers so as to face each other.

To achieve a filter circuit that is configured to have a good frequency rejection characteristic and suppress an increase in size due to mounting, in a more preferred aspect. A filter circuit includes a first signal line that is arranged to extend longitudinally, and a second signal line that is arranged to extend in parallel with the first signal line, in which the second signal line has one end that is electrically connected to the first signal line, and the other end that is open, in a longitudinal direction, and a length in the longitudinal direction that is determined according to a frequency of a signal to be blocked of signals transmitted through the first signal line.

An exemplary semiconductor technology implemented channelized filter includes a dielectric substrate with semiconductor fabricated metal traces on one surface, and input and output ports. A signal trace connected between the input and output port carries the signal to be filtered. Filter traces connect at intervals along the length of the signal trace to provide a reactance that varies with frequency. Ground traces provide a reference ground. A silicon enclosure with semiconductor fabricated cavities has a metal layer deposited over it. The periphery of the enclosure is dimensioned to engage corresponding ground traces about the periphery of the substrate. Walls of separate cavities enclose each of the filter traces to individually surround each thereby providing electromagnetic field isolation. Metal-to-metal conductive bonds are formed between cavity walls that engage the ground traces to establish a common reference ground. The filter traces preferably meander to minimize the footprint area of the substrate.

In some implementations, an electronics system includes a voltage regulator circuit of a PDN configured to generate a power signal, a printed circuit board (PCB) comprising a power rail to deliver the power signal to a digital circuit generating an interfering signal. The PDN radiating the interfering signal or its harmonics impacting the functionality of destination antenna and circuits (such as Wi-Fi, Bluetooth, cellular, etc.). The system includes a filtering element configured to filter an interfering signal generated by the digital circuit. The filtering element includes a first set of low impedance (low-Z) segments and a second set of high impedance (high-Z) segments. The low-Z and high-Z segments are formed using a copper trace of the power rail and are serially connected to each other. The filtering element forms a low pass filter and filters out high frequency interfering signal going to the destination antenna and circuits by radiated means.

An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

A wireless communication module includes a wireless module board including an antenna, a frequency converter mounted on the wireless module board and configured to change a frequency of a wireless signal, an amplifier phase shifter mounted on the wireless module board and configured to change a phase and an intensity of the wireless signal, a band-pass filter mounted on the wireless module board so as to be provided between the frequency converter and the amplifier phase shifter, and a band-rejection filter formed on the wireless module board and composed of at least a portion of a plurality of wiring layers electrically connecting the frequency converter, the amplifier phase shifter, and the band-pass filter to each other.

A microwave or radio frequency (RF) device includes a substrate including an electrically insulating material. The substrate has a first surface and a second surface parallel to the first surface. The device further includes a RF component disposed over the first surface of the substrate. The device also includes a conductive layer disposed over the second surface of the substrate, the conductive layer forming a ground plane electrically insulated from the RF component. The device further includes a defected ground structure disposed on a surface of the substrate that is coplanar with the first surface, where the defected ground structure is electrically connected to the conductive layer, and where the defected ground structure includes a plurality of laterally extending members adjacent to the RF component and extending laterally in relation to the RF component.

An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.