A band pass filter includes a dielectric substrate, conductor plates, a ground via, waveguide resonators, and a trap resonator. The conductor plates are inside the dielectric substrate and opposed to each other. The ground via connects the conductor plates together. The waveguide resonators are coupled in series in a space between the conductor plates along a principal coupling path from an input terminal to an output terminal. Waveguide resonators adjacent along the principal coupling path are subjected to inductive coupling. The trap resonator couples waveguide resonators in two pairs included in the waveguide resonators as jumping over a portion of the principal coupling path, and capacitive couples the waveguide resonators included in each of the pairs.

Disclosed herein are IC structures, packages, and devices that include III-N transistors integrated on the same substrate or die as resonators of RF filters. An example IC structure includes a support structure (e.g., a substrate), a resonator, provided over a first portion of the support structure, and an III-N transistor, provided over a second portion of the support structure. The IC structure includes a piezoelectric material so that first and second electrodes of the resonator enclose a first portion of the piezoelectric material, while a second portion of the piezoelectric material is enclosed between the channel material of the III-N transistor and the support structure. In this manner, one or more resonators of an RF filter may be monolithically integrated with one or more III-N transistors. Such integration may reduce costs and improve performance by reducing RF losses incurred when power is routed off chip.

The present disclosure discloses a band-stop filter and a radio frequency device, and the band-stop filter includes a cavity, an input port and an output port disposed on the cavity, and a transmission mainline and a plurality of resonators are disposed within the cavity, both ends of the transmission mainline are connected to the input port or the output port respectively, each resonator includes a resonant chamber and a resonant column disposed within the resonant chamber, a coupling wall is disposed between the resonant column and the corresponding transmission mainline, the coupling wall extends upwardly from the bottom wall of the cavity, the coupling wall and the transmission mainline are coupled.

An apparatus comprising: at least one cavity filter element wherein the cavity filter element comprises a first support, a second support distinct from the first support, and a coupling element supported by the first support and the second support. In some examples, there is a series of cavity filter elements. In some examples, the cavity filter element(s) are part of a cavity filter.

The disclosure provides a filtering module for a cavity filter having a housing defining an enclosed cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of planar resonators arranged within the cavity, one or more of the resonators being rotatable about an axis of rotation so as to vary an electric-field coupling between the resonator and other resonators of the plurality of resonators. The disclosure also provides a cavity filter having an input for receiving a signal to be filtered; a plurality of filtering modules, each filtering module comprising: a cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of resonators arranged within the cavity, at least one of the resonators being movable so as to vary an electromagnetic coupling between the resonator and other resonators of the plurality of resonators; and an output for outputting a filtered signal.

A method of manufacturing a ceramic resonator radio frequency filter includes placing one or more first coaxial resonators on a printed circuit board, and placing one or more second coaxial resonators over the one or more first coaxial resonators so that the coaxial resonators are arranged in a stacked configuration on the printed circuit board. The method also includes electrically connecting the one or more first coaxial resonators and second coaxial resonators to the printed circuit board.

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.

The disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than 4.sup.th generation (4G) communication systems such as long term evolution (LTE). A radio frequency (RF) filter in a wireless communication system is provided. The RF filter includes a structure including a resonance unit, and a cover plate at which a tuning structure is formed. The tuning structure includes a flexible arrangement with respect to the cover plate through an opening in the cover plate.

The disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4.sup.th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.