A filter structure improvement includes a substrate, resonance layers, a grounded layer, a pattern layer, an input electrode, and an output electrode. The substrate has resonance holes in which the resonance layers are disposed. One end of the resonance hole is on the open surface and the other end of the resonance hole is on the short-circuit surface. The grounded layer is on the short-circuit surface, top surface, bottom surface, and side surfaces and is electrically connected to the resonance layers to form a short-circuit end. The input and output electrodes, electrically isolated from the grounded layer, are on the bottom or open surface of the substrate. The pattern layer, resonance layers, and grounded layer are arranged to have electrical properties of a filter structure of mutual coupling such that a desired frequency band is obtained by adjusting the pattern layer and the lengths of the resonance layers.

A multi-band RF monoblock filter including at least three RF signal filters defined in the monoblock of dielectric material by resonators defined in part by through-holes extending through the block. In one embodiment, two of the RF signal filters are in a co-linear and side-by-side relationship and the third filter is in a parallel and side-by side relationship with one of the two other RF signal filters. A pattern of conductive material defines two end and one interior RF signal input/output on the block top surface. The end RF signal input/outputs are located at opposite ends of the block and the central RF signal input/output is located between the two co-linear and side-by-side RF filters. An RF signal is transmitted through the one end RF signal input/output, the two parallel and side-by-side RF signal filters, and the central RF signal input/output and also through the other end RF signal input/output, one of the co-linear and side-by-side RF filters, and the central RF signal input/output.

Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic stepped impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be, for example, tapered, sectioned, or stair-stepped in order to provide different impedances in the ceramic resonator.

This application describes an example dielectric resonator and a filter. One example dielectric resonator includes a body and an encirclement wall, where the encirclement wall is saliently disposed on a surface of the body. The encirclement wall of the dielectric resonator encircles the surface of the body to form a cavity area, where the encirclement wall isolates the cavity area from external space of the encirclement wall.

Dielectrically loaded filters useful for communication systems such as 5G systems can include a block of dielectric material having a top surface, bottom surface, and side surfaces. The bottom and side surfaces of such a block include an electrically conductive material thereon and the top surface includes metallized and unmetallized areas thereon. The metallized areas can include a plurality of conductive pads electrically connected to a plurality of through-holes. The dielectrically loaded filter further includes a coating of a parylene polymer on at least the metallized areas of the top surface of the block. Such parylene coated dielectrically loaded filters advantageously have higher power handling relative to the same filter but without the parylene coating.

Embodiments relate to the field of technologies of components of communications devices, and provide a dielectric filter, which resolves a problem that a solid dielectric filter has a difficulty in implementing capacitive coupling. The dielectric filter includes at least two dielectric resonators, where each of the dielectric resonators includes a body made of a solid dielectric material, and an adjusting hole located on a surface of the body. The adjusting hole is a blind hole, configured to adjust a resonance frequency of the dielectric resonator on which the blind hole is located. The bodies of all the dielectric resonators included by the dielectric filter form a body of the dielectric filter.

A multi-band RF monoblock filter including at least three RF signal filters defined in the monoblock of dielectric material by resonators defined in part by through-holes extending through the block. In one embodiment, two of the RF signal filters are in a co-linear and side-by-side relationship and the third filter is in a parallel and side-by side relationship with one of the two other RF signal filters. A pattern of conductive material defines two end and one interior RF signal input/output on the block top surface. The end RF signal input/outputs are located at opposite ends of the block and the central RF signal input/output is located between the two co-linear and side-by-side RF filters. An RF signal is transmitted through the one end RF signal input/output, the two parallel and side-by-side RF signal filters, and the central RF signal input/output and also through the other end RF signal input/output, one of the co-linear and side-by-side RF filters, and the central RF signal input/output.

A dielectric contactless transmission device provided with a pair of wavelength dielectric resonance components (2, 3) having: dielectric blocks (20, 30) that have a first surface (20a), a second surface (20b), third to sixth surfaces (20c-20f) connecting the first surface (20a) and the second surface (20b), and a resonance hole (20g) for making the first surface (20a) and the second surface (20b) communicate; intra-resonance hole conductors (21, 31) covering the inner surface of the resonance hole (20g); external conductors (22, 32) covering the second surface (20b) and the third to sixth surfaces (20c-20f), the external conductors (22, 32) being connected to one end of the intra-resonance hole conductors; and coupling electrodes (23, 33) arranged on the first surface (20a) while being isolated from the external conductors (22, 32) and connected to the other end of the intra-resonance hole conductors (21, 31), the first surfaces (20a) being arranged facing each other so that the coupling electrodes (23, 33) of the pair of wavelength dielectric resonance components (2, 3) are capacitively coupled.

A filter structure improvement includes a substrate, resonance layers, a grounded layer, a pattern layer, an input electrode, and an output electrode. The substrate has resonance holes in which the resonance layers are disposed. One end of the resonance hole is on the open surface and the other end of the resonance hole is on the short-circuit surface. The grounded layer is on the short-circuit surface, top surface, bottom surface, and side surfaces and is electrically connected to the resonance layers to form a short-circuit end. The input and output electrodes, electrically isolated from the grounded layer, are on the bottom or open surface of the substrate. The pattern layer, resonance layers, and grounded layer are arranged to have electrical properties of a filter structure of mutual coupling such that a desired frequency band is obtained by adjusting the pattern layer and the lengths of the resonance layers.

Embodiments relate to the field of technologies of components of communications devices, and provide a dielectric filter, which resolves a problem that a solid dielectric filter has a difficulty in implementing capacitive coupling. The dielectric filter includes at least two dielectric resonators, where each of the dielectric resonators includes a body made of a solid-state dielectric material, and an adjusting hole located on a surface of the body. The adjusting hole is a blind hole, configured to adjust a resonance frequency of the dielectric resonator on which the blind hole is located. The bodies of all the dielectric resonators included by the dielectric filter form a body of the dielectric filter.