The present invention reduces an electromagnetic coupling that can occur between a first signal line provided on a first substrate and a second signal line provided on a main surface of a second substrate on the first substrate side. A wireless module (10) includes an RFIC (28), a baseband IC (16), a first substrate (11) on which first signal lines (121 through 126) for transmitting a baseband signal are provided, and a second substrate (21) provided with second signal lines (2201 through 2232) for transmitting an RF signal on a main surface (211). The first substrate (11) is provided with a pseudo conductor wall (post wall 13) for shielding the first signal lines (121 through 126) and the second signal lines (2201 through 2232).

Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.

A feeder circuit includes: a first line 103 having first and second ends; a second line 104 having first and second ends; a third line 105 having first and second ends; a first combiner 101 configured to combine signals output from the second ends of the first and second lines 103 and 104; a first coupling portion 115 configured to electrically couple portions of the first and third lines to each other; and a second coupling portion 116 configured to electrically couple portions of the second and third lines to each other in a manner that allows a signal reaching the first combiner from the first end of the third line through the first coupling portion and a signal reaching the first combiner from the first end of the third line through the second coupling portion, to be cancelled out.

An RF crossover apparatus provides low transmission and return losses for microwave systems and meets the requirement for the RF signals to leap over each other as in an insulated state. The RF crossover apparatus contains a body produced from ceramic material, at least two RF strips placed inside the body in a way to intersect each other and at least one insulation layer insulating the RF strips placed on the body at least from the external environment. The body produced from ceramic material enables operation on high frequencies and this provides low transmission and return losses. The RF crossover apparatus also contains matching circuits on the tips of the RF strips for the RF strips to be passed to chip devices during use.

A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.

A planar antenna includes a dielectric layer including a first surface and a second surface on a side opposite from the first surface, an antenna conductor provided on the first surface, a ground conductor provided on the first surface or the second surface, or provided on both of the first surface and the second surface, and a transmission line including a signal line that is connected to the antenna conductor or provided in proximity to the antenna conductor, wherein a dielectric portion of the dielectric layer that is in contact with the signal line has a loss tangent of 0.007 or less at 28 GHz.

A compact band pass filter (BPF), including a first transmission line electromagnetically coupled to a second transmission line; and an isolating surface positioned between the first transmission line and the second transmission line, wherein the isolating surface includes at least one aperture designed to produce a desired electromagnetic coupling between the first transmission line and the second transmission line wherein the coupling produces a passband such that certain frequencies within an input transmission signal are filtered out.

A device includes at least one electrically conductive structure and at least one stripline. The stripline includes stripline sections that are connected to one another in a series connection between a first terminal and a second terminal. A first subset of the stripline sections is arranged on a first side of the conductive structure and a second subset of the stripline sections is arranged on a second side of the conductive structure. The device also includes at least one conductive connection between the first subset of the stripline sections and the second subset of the stripline sections, wherein the at least one conductive connection is isolated from the at least one electrically conductive structure.

A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capacitive element of the resonator is on the first surface.

A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.