Various embodiments disclosed relate to a circuit. The circuit includes a transceiver adapted to generate a signal. A stranded transmission line is connected to the transceiver. The signal is then transmitted through the first pair of conductive strands.

A semiconductor transmission line substructure and methods of transmitting RF signals are described. The semiconductor transmission line substructure can include a substrate; a first signal line over the substrate; a first ground line over the substrate; and a second semiconductor substrate over the substrate. The first signal line, the first ground line and the second semiconductor substrate are each vertically spaced apart from one another and can be separated from one another by at least one electrically insulating layer.

A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.

A flexible board includes a flexible body including a first principal surface and a second principal surface, and a linear conductor provided in the body and closer to the first principal surface than to the second principal surface. The body is bent inwardly with respect to the first principal surface along an inward bending line crossing the linear conductor and also outwardly with respect to the first principal surface along an outward bending line crossing the linear conductor. The inward bend of the body has a larger mean curvature radius than the outward bend of the body.

A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.

The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

A multi-wire wiring board including insulation-coated wires each including a wire and a wire coating layer, and a wire-laying adhesive sheet on which the insulation-coated wires are wire-laid, in which the multi-wire wiring board includes a wire-laying adhesive sheet on which a high-frequency-compatible wire is disposed, the high-frequency-compatible wire including the wire coating layer being a low-dielectric resin having a relative permittivity less than 3.6 at 10 GHz, and a wire-laying adhesive sheet on which a general wire is disposed, the general wire including the wire coating layer being a general resin having a relative permittivity of 3.6 or more at 10 GHz.

In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

A first signal conductor pattern, a first ground conductor pattern, and a second ground conductor pattern define a first transmission line with a strip line structure. A second signal conductor pattern, a third ground conductor pattern, and a fourth ground conductor pattern define a second transmission line with a strip line structure. A first connecting portion at an end of the first transmission line and a second connecting portion at an end of the second transmission line are stacked together so that the first ground conductor pattern is electrically connected to the third ground conductor pattern, the second ground conductor pattern is electrically connected to the fourth ground conductor pattern, and the first signal conductor pattern is electrically connected to the second signal conductor pattern.