An aspect of the present invention reduces loss that may occur in cases where electromagnetic waves are guided from one main surface side of a substrate to the other main surface side of the substrate. A waveguide device (10, 10A, 20) includes: a substrate (11); a first conductor layer (12A) and a second conductor layer (12B) which are provided on both main surfaces of the substrate, respectively; a main conductor post (MP) which penetrates between the both main surfaces; and one or more sub-conductor posts (SP) which penetrate between the both main surfaces and which, together with the main conductor post, guide a TEM mode or a quasi-TEM mode.

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

A circuit board includes one or more insulator layers, and upper and lower principal surfaces, and conductor layers in or on the substrate body. The conductor layers include a pair of first and second conductor layers on one of the insulator layers. Each of the pairs of the first and second conductor layers includes a first proximity section in which the first and second conductor layers are aligned in an orthogonal direction to an extending direction of the first conductor layer. A distance between the first and second conductor layers in the first proximity section is defined as a proximity distance. Most proximate first and second conductor layers are defined as the first and second conductor layers with a smallest proximity distance and are located on an upper principal surface of a first insulator layer of the one or more insulating layers.

A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.

In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.

An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.

Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.

Aspects of the present disclosure are directed to a photonic integrated circuit (PIC) having a resistivity-engineered substrate to suppress radio-frequency (RF) common-mode signals. In some embodiments, a semiconductor substrate is provided that comprises two portions having different levels of resistivity to provide both suppression of common mode signals, and reduction of RF absorption loss for non-common mode RF signals. In such embodiments, a bottom portion of the semiconductor substrate has a low resistivity to suppress common mode via RF absorption, while a top portion of the semiconductor substrate that is adjacent to conductors in the IC has a high resistivity to reduce RF loss.