The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

A high directivity compact size inter-layer coupler that has application for coupling off a pre-distortion coupling signal from a main signal at an output of a power amplifier to a pre-distortion circuit. The coupler includes a main signal line formed on a surface of a first dielectric layer opposite to a second dielectric layer, where the main signal line receives the main signal, and a coupling line formed between the second dielectric layer and a third dielectric layer, where the coupling line is electromagnetically coupled to the main line so as to generate the coupling signal thereon. The coupling line has a general U-shape including a first leg portion, a second leg portion and a transverse portion between the first and second leg portions. The transverse portion includes a plurality of spaced apart blocks coupled together by a narrow line portion.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.

A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.

A signal via has a via diameter that causes a high-frequency signal to be propagated through a high-frequency transmission line using multi mode transmission (multi-mode interference transmission). At least one of the inter-via distance between the signal via and respective ground vias, the via diameter, and the thickness of the multilayer substrate is determined to introduce the high-frequency signal from the interlayer transmission line to the signal lines in the high-intensity region of the multi mode transmission.

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

A transmission line structure includes a first transmission line having a first and a second extending line segments and a first and a second line segments extending along a first direction and a third line segment extending along a second direction, and a second transmission line having a third and a fourth extending line segments, a fourth and a fifth line segments extending along the first direction and a sixth line segment extending along the second direction. The first and the second extending line segment are connected to ends of the first and the second line segment. The third line segment is connected to sides of the first and the second line segment. The third and the fourth extending line segment are connected to ends of the fourth the fifth line segment. The sixth line segment is connected to sides of the fourth and the fifth line segment.