H01P3/084

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Feeding network for base station antenna
09559429 · 2017-01-31 · ·

The present disclosure relates to feeding networks for base station antenna. Embodiments of the disclosure may comprise first and second phase shifters, and a 3-way power divider, including an input terminal, a first output terminal for feeding a first unit, a second output terminal connecting to the first phase shifter, and a third output terminal connecting to the second phase shifter. The feeding network may also comprise a first 2-way power divider, including an input terminal connecting to the first phase shifter, a first output terminal for feeding a second unit, and a second output terminal for cascading a third phase shifter. In addition, the feeding network may comprise a second 2-way power divider, including an input terminal connecting to the second phase shifter, a first output terminal for feeding a third unit, and a second output terminal for cascading a fourth phase shifter.

Transmission line structure having a signal line spaced apart from ground by an air layer and the signal line is supported at a center part thereof

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmission line structure of a wireless communication system is provided. The transmission line includes a ground area, a signal line, and a support. A first surface of the signal line is disposed to be spaced apart from the ground area via an air layer therebetween, a second surface of the signal line located opposite to the first surface may be coupled to the support, and the support may be coupled to the ground area.

ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). According to an embodiment of the disclosure, an antenna structure of a wireless communication system may include: at least one antenna element including at least one antenna, a power divider configured to feed the at least one antenna element, and a substrate, the at least one antenna element and the power divider may be disposed on the substrate, and, the substrate may include a first dielectric layer having an air layer in a region corresponding to a first region in which the power divider is disposed on the substrate, and a second dielectric layer disposed between the first dielectric layer and the power divider.

Metal Structure for a Component Carrier and Manufacturing Method

A metal structure for a component carrier includes a first metal layer structure having a first recess exposed to a first surface and defining a first external boundary profile; and a second metal layer structure having a second recess exposed to a second surface and defining a second external boundary profile. The first metal layer structure and the second metal layer structure are stacked to face each other, so that the first recess and the second recess define a common recess, and the first external boundary profile of the first recess and the second external boundary profile of the second recess are misaligned in the stacking direction of the metal structure.

TRANSMISSION LINE STRUCTURE FOR REDUCING INSERTION LOSS AND ELECTRONIC DEVICE INCLUDING THE SAME

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmission line structure of a wireless communication system is provided. The transmission line includes a ground area, a signal line, and a support. A first surface of the signal line is disposed to be spaced apart from the ground area via an air layer therebetween, a second surface of the signal line located opposite to the first surface may be coupled to the support, and the support may be coupled to the ground area.