H01P5/22

Branch-line directional coupler and power amplifier device

A branch line directional coupler has a first line, a second line, a first open-ended coupled circuit, and a second open-ended coupled circuit. The first and second lines have a first characteristic impedance and a quarter wavelength length. The first open-ended coupled line has one end connected to the first line and the other end connected to the second line. The second open-ended coupled line has one end connected to the first line and the other end connected to the second line. The first open-ended coupled line has two coupled lines having a coupling length of a quarter wavelength, an open stub, and a connecting line, and has a total length of one-half wavelength. The second open-ended coupled line includes two coupled lines having a coupling length of ¼-wavelength, open stubs, and a connecting line, and has a total length of ½-wavelength.

Branch-line directional coupler and power amplifier device

A branch line directional coupler has a first line, a second line, a first open-ended coupled circuit, and a second open-ended coupled circuit. The first and second lines have a first characteristic impedance and a quarter wavelength length. The first open-ended coupled line has one end connected to the first line and the other end connected to the second line. The second open-ended coupled line has one end connected to the first line and the other end connected to the second line. The first open-ended coupled line has two coupled lines having a coupling length of a quarter wavelength, an open stub, and a connecting line, and has a total length of one-half wavelength. The second open-ended coupled line includes two coupled lines having a coupling length of ¼-wavelength, open stubs, and a connecting line, and has a total length of ½-wavelength.

Energy absorbing circuit
11038282 · 2021-06-15 · ·

An energy absorbing circuit includes a power divider that is configured to divide an incoming RF signal into a plurality of RF component signals; a plurality of transmission lines that are connected with the power divider, each of the transmission lines configured to transmit a respective RF component signal of the plurality of RF component signals; and a plurality of matching elements, each matching element being terminated to a respective one of the transmission lines.

Amplifier for a transceiver and a transceiver comprising such an amplifier
20210075383 · 2021-03-11 ·

An amplifier for a transceiver comprising

plurality of power amplifiers arranged on a base, each power amplifier comprising a power amplifier input port and a power amplifier output port;

a planar power splitter arranged on the base, the power splitter comprising a power splitter input port and a plurality of power splitter output ports;

each power amplifier input port being connected to a power splitter output port by a planar transmission line;

each power amplifier output port being connected to a waveguide transition;

a plurality of waveguides each defined by a waveguide wall, each waveguide being arranged within the base, each waveguide transition being connected to waveguide; and,

a waveguide power combiner arranged within the base, each waveguide being connected to the waveguide power combiner.

Amplifier for a transceiver and a transceiver comprising such an amplifier
20210075383 · 2021-03-11 ·

An amplifier for a transceiver comprising

plurality of power amplifiers arranged on a base, each power amplifier comprising a power amplifier input port and a power amplifier output port;

a planar power splitter arranged on the base, the power splitter comprising a power splitter input port and a plurality of power splitter output ports;

each power amplifier input port being connected to a power splitter output port by a planar transmission line;

each power amplifier output port being connected to a waveguide transition;

a plurality of waveguides each defined by a waveguide wall, each waveguide being arranged within the base, each waveguide transition being connected to waveguide; and,

a waveguide power combiner arranged within the base, each waveguide being connected to the waveguide power combiner.

FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FROM IC TO PCB VIA CHIP-SCALE PACKAGING

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FROM IC TO PCB VIA CHIP-SCALE PACKAGING

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

Hybrid coupler with sum and difference ports located on the same side

This invention refers to hybrid coupler with the sum port and difference port located on the same side. The hybrid coupler can be efficiently integrated into the high frequency circuit with its simple structure, using common material. To achieve this purpose, the hybrid coupler in this invention consists of the following parts: sum port, difference port, output port 1, output port 2, connection line 1, connection line 2 and microstrip line.