A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

The phased array antenna system is described. The phased array antenna system formed on one or more layers of a printed circuit board (PCB). The phased array antenna system be may include a beam forming network to convert between one or more element signals and a beam signal. The phased array antenna system may include one or more control circuits, where each control circuit may receive the element signals for corresponding antenna element. Each of the control circuits may further may establish a control signal path and an element signal path between the antenna elements and the beamforming network, where the signal path may carry multiplexed element and control signals. The control circuits may include a signal adjustment circuit that may adjust the corresponding element signal (e.g., in phase or amplitude) based on the control signal.

A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.

Methods and systems are described for providing end-to-end beamforming. For example, end-to-end beamforming systems include end-to-end relays and ground networks to provide communications to user terminals located in user beam coverage areas. The ground segment can include geographically distributed access nodes and a central processing system. Return uplink signals, transmitted from the user terminals, have multipath induced by a plurality of receive/transmit signal paths in the end to end relay and are relayed to the ground network. The ground network, using beamformers, recovers user data streams transmitted by the user terminals from return downlink signals. The ground network, using beamformers generates forward uplink signals from appropriately weighted combinations of user data streams that, after relay by the end-end-end relay, produce forward downlink signals that combine to form user beams.

Methods and systems are described for providing end-to-end beamforming. For example, end-to-end beamforming systems include end-to-end relays and ground networks to provide communications to user terminals located in user beam coverage areas. The ground segment can include geographically distributed access nodes and a central processing system. Return uplink signals, transmitted from the user terminals, have multipath induced by a plurality of receive/transmit signal paths in the end to end relay and are relayed to the ground network. The ground network, using beamformers, recovers user data streams transmitted by the user terminals from return downlink signals. The ground network, using beamformers generates forward uplink signals from appropriately weighted combinations of user data streams that, after relay by the end-end-end relay, produce forward downlink signals that combine to form user beams.

The present invention provides a new wideband mm-wave end-fire magneto-electric dipole antenna with excellent beam-scanning radiation patterns and reasonably low side lobes and low cross polarizations. The antenna comprises: an asymmetrical substrate integrated coaxial line feed comprising: a first substrate having a first substrate thickness; a second substrate placed on the first substrate and having a second substrate thickness different from the first substrate thickness; a conductive signal line deposited on an upper surface of the first substrate; and two rows of waveguiding vias positioned along and at both sides of the signal line respectively; a Γ-shaped probe adopted to excite the antenna; a pair of shorted planar parallel plates serving as magnetic dipole and two pair of vertical conductive vias serving as electric dipole; and a folded vertical reflector consisting of conductive vias and strips is added to reduce the back radiation and to improve the gain of antenna.

The present invention provides a new wideband mm-wave end-fire magneto-electric dipole antenna with excellent beam-scanning radiation patterns and reasonably low side lobes and low cross polarizations. The antenna comprises: an asymmetrical substrate integrated coaxial line feed comprising: a first substrate having a first substrate thickness; a second substrate placed on the first substrate and having a second substrate thickness different from the first substrate thickness; a conductive signal line deposited on an upper surface of the first substrate; and two rows of waveguiding vias positioned along and at both sides of the signal line respectively; a Γ-shaped probe adopted to excite the antenna; a pair of shorted planar parallel plates serving as magnetic dipole and two pair of vertical conductive vias serving as electric dipole; and a folded vertical reflector consisting of conductive vias and strips is added to reduce the back radiation and to improve the gain of antenna.

There is provided an antenna arrangement for a radio transceiver device for simultaneous use of two polarization directions. The antenna arrangement comprises at least two baseband chains. The antenna arrangement further comprises a first set of antenna elements of a first polarization direction, and a second set of antenna elements of a second polarization direction. The antenna arrangement comprises an analog distribution network operatively connecting the at least two baseband chains to both sets of antenna elements. All of the baseband chains are operatively connected to each respective antenna element of the first set and to each respective antenna element of the second set via the analog distribution network.

There is provided an antenna arrangement for a radio transceiver device for simultaneous use of two polarization directions. The antenna arrangement comprises at least two baseband chains. The antenna arrangement further comprises a first set of antenna elements of a first polarization direction, and a second set of antenna elements of a second polarization direction. The antenna arrangement comprises an analog distribution network operatively connecting the at least two baseband chains to both sets of antenna elements. All of the baseband chains are operatively connected to each respective antenna element of the first set and to each respective antenna element of the second set via the analog distribution network.