H01Q5/335

Electronic device and antenna structure thereof

An electronic device and an antenna structure thereof are provided. The antenna structure includes a first radiating member, a feeding member disposed on the first radiating member, a second radiating member, and a grounding member. A first predetermined gap is between the feeding member and the first radiating member. The feeding member, the first predetermined gap, and the first radiating member resonate to generate a low frequency band and a high frequency band. The second radiating member including a main body and a grounding part is disposed on the first radiating member. A second predetermined gap is between the main body and the first radiating member. The grounding part, the main body, and the second predetermined gap resonate to increase a bandwidth of the low frequency band. The grounding member is disposed on the first radiating member and electrically connected to the grounding part.

Self-optimizing wide band array antennas
11469503 · 2022-10-11 · ·

An antenna system including one or more a frequency responsive components (FRCs) may employ filters to one or more paths in the antenna system corresponding one or more radiating elements on those paths. The FRCs can block a signal from reaching the radiating elements effectively causing the radiating elements to become non-contributing to the antenna systems radiating pattern performance, and thus, maintain a consistent aperture value associated with the antenna system. In some cases, the FRCs may be configured to block a signal when the antenna system is operating at a particular frequency.

Self-optimizing wide band array antennas
11469503 · 2022-10-11 · ·

An antenna system including one or more a frequency responsive components (FRCs) may employ filters to one or more paths in the antenna system corresponding one or more radiating elements on those paths. The FRCs can block a signal from reaching the radiating elements effectively causing the radiating elements to become non-contributing to the antenna systems radiating pattern performance, and thus, maintain a consistent aperture value associated with the antenna system. In some cases, the FRCs may be configured to block a signal when the antenna system is operating at a particular frequency.

Multi-band radio frequency front-end circuit
11626892 · 2023-04-11 · ·

A multi-band radio frequency (RF) front-end circuit is provided. The multi-band RF front-circuit includes multiple RF circuits configured to amplify RF signals received and/or to be transmitted in multiple RF bands and/or polarizations via an antenna circuit. The antenna circuit includes multiple antenna tap points each coupled to a respective one of the RF circuits. Since each of the RF circuits has a respective impedance that can vary based on the RF bands, the antenna tap points are so positioned on the antenna circuit to each present a respective drive impedance that matches the respective impedance of a coupled RF circuit. Further, the antenna tap points are also positioned on the antenna circuit to cause desired RF isolations between the RF bands and/or the polarizations. Consequently, the multi-band RF front-end circuit can achieve optimal RF performance across a wide range of RF bands with reduced footprint and insertion losses.

Multi-band radio frequency front-end circuit
11626892 · 2023-04-11 · ·

A multi-band radio frequency (RF) front-end circuit is provided. The multi-band RF front-circuit includes multiple RF circuits configured to amplify RF signals received and/or to be transmitted in multiple RF bands and/or polarizations via an antenna circuit. The antenna circuit includes multiple antenna tap points each coupled to a respective one of the RF circuits. Since each of the RF circuits has a respective impedance that can vary based on the RF bands, the antenna tap points are so positioned on the antenna circuit to each present a respective drive impedance that matches the respective impedance of a coupled RF circuit. Further, the antenna tap points are also positioned on the antenna circuit to cause desired RF isolations between the RF bands and/or the polarizations. Consequently, the multi-band RF front-end circuit can achieve optimal RF performance across a wide range of RF bands with reduced footprint and insertion losses.

ANTENNA STRUCTURE AND METHOD FOR SIGNAL CALIBRATION

An antenna structure includes a first antenna, a second antenna, at least one processor, a power distribution circuit configured to equally supply power supplied from the processor(s) to the first antenna and the second antenna, and a coupler disposed between the processor(s) and the power distribution circuit, wherein the processor(s) may obtain a first parameter for a first signal received by the first antenna and a second parameter for a second signal received by the second antenna, detect a phase difference between the first signal and the second signal, obtain a matching parameter based on parameters corresponding to a case in which the phase difference satisfies a specified condition among the first parameter and the second parameter, and obtain a third parameter for allowing a reflection coefficient of a signal flowing from the power distribution circuit to the coupler to exist within a specified range among the matching parameters.

ANTENNA STRUCTURE AND METHOD FOR SIGNAL CALIBRATION

An antenna structure includes a first antenna, a second antenna, at least one processor, a power distribution circuit configured to equally supply power supplied from the processor(s) to the first antenna and the second antenna, and a coupler disposed between the processor(s) and the power distribution circuit, wherein the processor(s) may obtain a first parameter for a first signal received by the first antenna and a second parameter for a second signal received by the second antenna, detect a phase difference between the first signal and the second signal, obtain a matching parameter based on parameters corresponding to a case in which the phase difference satisfies a specified condition among the first parameter and the second parameter, and obtain a third parameter for allowing a reflection coefficient of a signal flowing from the power distribution circuit to the coupler to exist within a specified range among the matching parameters.

SEMICONDUCTOR ELEMENT
20230155292 · 2023-05-18 ·

A semiconductor element comprising: an antenna array that is provided with a plurality of antennas each including a semiconductor layer having an electromagnetic wave gain or carrier nonlinearity with respect to a terahertz wave; and a coupling line that synchronizes adjacent antennas in the antenna array with each other at a frequency of the terahertz wave, wherein the coupling line includes a plurality of first regions connected to the adjacent antennas respectively and a second region provided between the plurality of first regions, wherein the second region has impedance different from impedance of each of the first regions, and wherein the second region has a loss larger than a loss of the individual first region at a frequency other than a resonance frequency of the antenna array.

Tunable antenna system for Bluetooth and Wi-Fi bands with electronically-reconfigurable and mechanically-identical antennas

Systems and methods for operating a radio system include configuring a first antenna of a plurality of antennas in a wireless device to operate in a configured mode of a plurality of modes, wherein the plurality of modes include a first mode of operating as a quarter wave for operation in a 2.4 GHz band, a second mode of operating as a half wave for operation in a 5 GHz band, and a third mode of operating simultaneous as a half wave and a quarter wave for operation in both the 2.4 GHz band and the 5 GHz band; and operating a first radio of a plurality of radios connected to the first antenna in the configured mode of the first antenna.

RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
20230143170 · 2023-05-11 ·

A radio-frequency module includes a multilayer substrate, a first semiconductor device, and a second semiconductor device. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first semiconductor device includes a first power amplifier circuit. The second semiconductor device includes at least one of a low-noise amplifier circuit, a switching circuit, or a control circuit. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face.