A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.

According to an embodiment of the disclosure, an electronic device may include: a printed circuit board (PCB); a plurality of lines disposed on the PCB; a plurality of conductive pads disposed at an upper surface of the PCB on which the plurality of lines are disposed; a first antenna pattern disposed at the upper surface of the PCB and electrically connected to a first conductive pad of the plurality of conductive pads; and a first switch electrically connected to the first antenna pattern.

An electronic device is provided. The electronic device includes a housing including a first segment portion and a second segment portion, a first antenna formed between the first segment portion and the second segment portion, and a processor electrically connected to the first antenna, the first antenna includes a first point disposed adjacent to the first segment portion, a third point disposed adjacent to the second segment portion, and a second point disposed between the first point and the third point, and the processor is configured to control feeding signals and/or ground signals of the first point, the second point or the third point, and control the electrical path of the first antenna between the first segment portion and the second segment portion, the first antenna operates in different frequency bands. The first antenna operating at a resonance frequency having the optimum radiation efficiency and performance in a wideband.

An electronic device is provided. The electronic device includes a housing including a first segment portion and a second segment portion, a first antenna formed between the first segment portion and the second segment portion, and a processor electrically connected to the first antenna, the first antenna includes a first point disposed adjacent to the first segment portion, a third point disposed adjacent to the second segment portion, and a second point disposed between the first point and the third point, and the processor is configured to control feeding signals and/or ground signals of the first point, the second point or the third point, and control the electrical path of the first antenna between the first segment portion and the second segment portion, the first antenna operates in different frequency bands. The first antenna operating at a resonance frequency having the optimum radiation efficiency and performance in a wideband.

An electronic apparatus is provided. The electronic apparatus includes a housing which comprises a front surface plate, a rear surface plate oriented in the opposite direction to the front surface plate, and a side surface member surrounding the space between the front surface plate and the rear surface plate, at least a portion of the side surface member including at least one conductive section positioned between a first non-conductive section and a second non-conductive section which are spaced apart from each other, a conductive extended portion part extending from at least a partial area of the conductive section to the space, a printed circuit board disposed in the space, and a wireless communication circuit disposed on the printed circuit board and electrically connected a point which is in the conductive section and spaced toward a first location from the first non-conductive section.

A wireless communication device and an antenna matching circuit are provided. The wireless communication device includes an RF transceiver, a first SPDT switch, a low noise amplifier, a power amplifier, and the antenna matching circuit. The antenna matching circuit includes a second SPDT switch, a first antenna element, a second antenna element, a first transmission path, a second transmission path, and a plurality of SPST switches. The second SPDT switch is connected to the first SPDT switch. When the antenna matching circuit is switched to a first mode, the second SPDT switch is switched to the first transmission path, and the first antenna element is used to generate a first radiation pattern. When the antenna matching circuit is switched to a second mode, the second SPDT switch is switched to the second transmission path, and the second antenna element is used to generate a second radiation pattern.

A wireless communication device and an antenna matching circuit are provided. The wireless communication device includes an RF transceiver, a first SPDT switch, a low noise amplifier, a power amplifier, and the antenna matching circuit. The antenna matching circuit includes a second SPDT switch, a first antenna element, a second antenna element, a first transmission path, a second transmission path, and a plurality of SPST switches. The second SPDT switch is connected to the first SPDT switch. When the antenna matching circuit is switched to a first mode, the second SPDT switch is switched to the first transmission path, and the first antenna element is used to generate a first radiation pattern. When the antenna matching circuit is switched to a second mode, the second SPDT switch is switched to the second transmission path, and the second antenna element is used to generate a second radiation pattern.

The present disclosure falls within the technical field of communications, and specifically discloses an external triple-frequency antenna for an unmanned aerial vehicle, including a substrate, vibrator circuits, and a feed line. Preferably, the vibrator circuits are disposed on the substrate. The vibrator circuits include a high-frequency vibrator circuit, a middle-frequency vibrator circuit, and a low-frequency vibrator circuit; a shared microstrip line is disposed between the middle-frequency vibrator circuit and the low-frequency vibrator circuit; the feed line includes a first feed line and a second feed line, where the first feed line is connected to the high-frequency vibrator circuit; and the second feed line is connected to the shared microstrip line, and a capacitor is disposed at the connection of the second feed line and the shared microstrip line.

The present disclosure falls within the technical field of communications, and specifically discloses an external triple-frequency antenna for an unmanned aerial vehicle, including a substrate, vibrator circuits, and a feed line. Preferably, the vibrator circuits are disposed on the substrate. The vibrator circuits include a high-frequency vibrator circuit, a middle-frequency vibrator circuit, and a low-frequency vibrator circuit; a shared microstrip line is disposed between the middle-frequency vibrator circuit and the low-frequency vibrator circuit; the feed line includes a first feed line and a second feed line, where the first feed line is connected to the high-frequency vibrator circuit; and the second feed line is connected to the shared microstrip line, and a capacitor is disposed at the connection of the second feed line and the shared microstrip line.

A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.