The disclosed broadband antenna module for LTE includes: a feeding pin and a direct short pin that are spaced apart from each other on one surface of a printed circuit board; a coupling short pin formed of a conductive material on the other surface of the printed circuit board and connected to a ground plane; and a radiation patch antenna including a dielectric and a radiation pattern formed on an outer circumference of the dielectric and mounted on one surface of the printed circuit board, in which the radiation pattern of the radiation patch antenna is directly connected to the feeding pin and direct short pin and coupled to the coupling short pin in an overlapping manner.

In examples, systems and methods for increasing the performance of electrically-small antennas are described. An example system comprises an electrically-small antenna having an antenna feed. The electrically-small antenna is configured to receive a signal. The system also comprises a non-foster circuit having a negative capacitance coupled to the antenna feed in a shunt position. The non-foster circuit is configured to resonate the electrically-small antenna and provide a voltage increase to the received signal. The system also comprises a buffer circuit configured to provide an impedance conversion of the voltage-increased received signal between the antenna feed and an output of the buffer circuit. The buffer circuit includes a field-effect transistor.

An antenna element and an electronic device including the antenna element are provided. The antenna element includes a combiner, a first antenna, a second antenna, a feed, a first connection circuit, a second connection circuit, a first ground circuit, and a second ground circuit. The combiner has a first input terminal electrically connected to the first antenna via the first connection circuit, a second input terminal electrically connected to the second antenna via the second connection circuit, and an output terminal electrically connected to the feed. One end of the first ground circuit is electrically connected to the first antenna. One end of the second ground circuit is electrically connected to the second antenna.

In a wireless communication device, an impedance matching circuit includes a first layered coil conductor one end of which is connected to a first I/O terminal, the first layered coil conductor includes loop conductors including a plurality of layers, and a second layered coil conductor one end of which is connected to the other end of the first layered coil conductor and the other end of which is respectively connected to a second I/O terminal, the second layered coil conductor includes loop conductors including a plurality of layers. On the surface of the wireless communication device, first and second terminal electrodes are connected via first and second in-plane conductors and first and second inter-layer conductors to any of the loop conductors of the first and second layered coil conductors. Connection locations of the first and second in-plane conductors to the first and second layered conductors determine the antenna element-side impedance seen by the first and second I/O terminals of the wireless IC chip.

In a wireless communication device, an impedance matching circuit includes a first layered coil conductor one end of which is connected to a first I/O terminal, the first layered coil conductor includes loop conductors including a plurality of layers, and a second layered coil conductor one end of which is connected to the other end of the first layered coil conductor and the other end of which is respectively connected to a second I/O terminal, the second layered coil conductor includes loop conductors including a plurality of layers. On the surface of the wireless communication device, first and second terminal electrodes are connected via first and second in-plane conductors and first and second inter-layer conductors to any of the loop conductors of the first and second layered coil conductors. Connection locations of the first and second in-plane conductors to the first and second layered conductors determine the antenna element-side impedance seen by the first and second I/O terminals of the wireless IC chip.

A solution to the technical problem of improving antenna performance for wearable electronic devices includes increasing the distance between the antenna and the user's body. In the example of an electronic device implemented within eyeglasses, the antenna distance may be increased by locating the antenna on an outer rim of an eyeglasses lens. This increased distance between the antenna and the user's head decreases the SAR observed at the user's head. This increased distance also enables improved impedance matching and improved antenna return loss, which improves antenna receiver sensitivity and increases antenna transmission effectiveness.

A solution to the technical problem of improving antenna performance for wearable electronic devices includes increasing the distance between the antenna and the user's body. In the example of an electronic device implemented within eyeglasses, the antenna distance may be increased by locating the antenna on an outer rim of an eyeglasses lens. This increased distance between the antenna and the user's head decreases the SAR observed at the user's head. This increased distance also enables improved impedance matching and improved antenna return loss, which improves antenna receiver sensitivity and increases antenna transmission effectiveness.

A square bracket-shaped radiation element is in a non-ground region of a board. A first reactance element that equivalently enters a short-circuited state in a second frequency band is connected between a second end of the radiation element and a ground conductor. A second reactance element that equivalently enters a short-circuited state in a first frequency band s connected between a first end of the radiation element and the ground conductor. In the UHF band, the radiation element and the ground conductor function as an inverted F antenna that contributes to field emission. In the HF band, a loop including the radiation element and the ground conductor functions as a loop antenna that contributes to magnetic field emission.

A square bracket-shaped radiation element is in a non-ground region of a board. A first reactance element that equivalently enters a short-circuited state in a second frequency band is connected between a second end of the radiation element and a ground conductor. A second reactance element that equivalently enters a short-circuited state in a first frequency band s connected between a first end of the radiation element and the ground conductor. In the UHF band, the radiation element and the ground conductor function as an inverted F antenna that contributes to field emission. In the HF band, a loop including the radiation element and the ground conductor functions as a loop antenna that contributes to magnetic field emission.

A circuit (4) for establishing a desired impedance value for a radio antenna (5) comprising a transistor (3) having an input (8) and an output terminal (6), and a printed radio frequency transformer comprising a first (1) and a second inductor (2), both inductors (1, 2) having a coupling factor value, and having a first and a second terminal (11, 12; 21, 22). The first terminal (11) of the first inductor (1) is adapted for connecting a radio antenna (5). The input terminal (8) of the transistor (3) is connected to the second terminal (12) of the first inductor (1), and the output terminal (6) of the transistor (3) is connected to the first terminal (21) of the second inductor (2), so that the desired impedance value (Z.sub.2) at the second terminal (22) of the second inductor (2) is determined by the inductance value of the second inductor (2).