One embodiment disclosed in the present disclosure may provide an antenna device that includes: a metal member that forms at least a part of an external housing for the electronic device; a printed circuit board (PCB) coupled to a feed connector of the metal member, such that the metal member is configured to operate as an antenna radiator for the PCB; and the metal member further including at least two grounding connectors that are coupled to ground through the PCB, wherein the feed connector and the two grounding connectors are located at different positions on the metal member, and may provide an electronic device that includes the same. Accordingly, it is possible to easily design an antenna that operates in a desired frequency band, to reduce the cost, to make the exterior of the device appealing due to the advantage of design, and to maximize the efficient use of space for the design of a multiband antenna.

An electronic device is disclosed, where the electronic device is provided with a metal frame, the electronic device further includes an antenna feeding point, an antenna ground, a feeding branch, a grounding branch, an antenna resonance arm, a variable capacitor, and a control circuit. The antenna resonance arm is a part of the metal frame after segmentation, the antenna feeding point is disposed on the feeding branch, a first connection portion and a second connection portion are disposed on the antenna resonance arm, the feeding branch is disposed between the second connection portion and the antenna ground, the grounding branch is disposed between the first connection portion and the antenna ground, the variable capacitor is disposed on the feeding branch, the variable capacitor is disposed between the antenna feeding point and the second connection portion, and the control circuit is configured to adjust a capacitance of the variable capacitor.

An antenna apparatus includes a circuit board and an antenna body. The antenna body includes a first radiator and a second radiator that are indirectly coupled. The first radiator comprises a first stub and a second stub that are opposite to, but do not touch each other to form a first gap, the first stub and the second stub are located on a first side edge of the circuit board, a second gap is configured between the first stub and the first side edge, and also between the second stub and the first side edge. The second radiator is located on the circuit board to form a third gap in-between. A vertical projection of the second radiator is located on the first surface. The first stub and the second stub are electrically connected to reference ground of the circuit board separately.

An antenna apparatus includes a circuit board and an antenna body. The antenna body includes a first radiator and a second radiator that are indirectly coupled. The first radiator comprises a first stub and a second stub that are opposite to, but do not touch each other to form a first gap, the first stub and the second stub are located on a first side edge of the circuit board, a second gap is configured between the first stub and the first side edge, and also between the second stub and the first side edge. The second radiator is located on the circuit board to form a third gap in-between. A vertical projection of the second radiator is located on the first surface. The first stub and the second stub are electrically connected to reference ground of the circuit board separately.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

The invention relates to a balanced antenna system comprising a radiator connected via a matching circuit to a balun. In certain embodiments, the radiator comprises a first radiating element and a second radiating element and the matching circuit comprises a first impedance-matching circuit connected to the first radiating element and a second impedance-matching circuit connected to the second radiating element. The first and second matching circuits may be identical and are connected through the balun to a single port. To minimize the component count, the design of the matching circuit and balun is co-optimized.

An antenna structure includes a radiation body, a grounding portion, a feeding portion, and a variable capacitor. The grounding portion is coupled to the radiation body and is configured to couple to ground. The feeding portion is coupled between the radiation body and the variable capacitor, the feeding portion is configured to receive feeding signals via the variable capacitor.

An antenna structure includes a radiation body, a grounding portion, a feeding portion, and a variable capacitor. The grounding portion is coupled to the radiation body and is configured to couple to ground. The feeding portion is coupled between the radiation body and the variable capacitor, the feeding portion is configured to receive feeding signals via the variable capacitor.

A method for designing a surface pattern for an impedance surface which results in a position-dependent target impedance of said impedance surface, and the impedance surface having the position-dependent target impedance radiates a desired first-type electromagnetic field radiation in reaction to being irradiated by a second-type electromagnetic field radiation. The method includes obtaining a first modal representation on the basis of the first-type electromagnetic field radiation in terms of a set of base modes that are chosen in accordance with a model function of the position-dependent target impedance, and obtaining a second modal representation on the basis of the second-type electromagnetic field radiation and the model function in terms of the set of base modes. The method further includes obtaining a first position-dependent quantity indicative of the position-dependent target impedance on the basis of the first modal representation and the second modal representation by determining values for a plurality of parameters of the model function for maximizing an overlap between the first modal representation and the second modal representation, and obtaining, as the surface pattern, a second position-dependent quantity indicative of geometric characteristics of the impedance surface on the basis of the first position-dependent quantity and a relationship between geometric characteristics of the impedance surface and corresponding impedance values.