Disclosed is a mobile terminal. The mobile terminal comprises a body, an insulating bezel surrounding the periphery of the body, and a wire that is located in the insulating bezel and that acts as an antenna. The wire comprises a first line segment and at least two bending line segments that are connected to the first line segment. The bending line segments bend and extend into convex shapes from the connecting position of the first line segment, at least one bending line segment acts as the ground point of the antenna, and at least one bending line segment acts as the feed point of the antenna.

A wireless communication device is provided. The wireless communication device comprises a circuit board, a key module and a sensing module. The key module is electrically connected with at least one key through the circuit board. The sensing module is electrically connected with the circuit board, wherein the circuit board is taken as an induction conductor of the sensing module. Therefore, according to the wireless communication device disclosed by the disclosure, the functions of the key module, the sensing module and an antenna module are integrated on a same component, so that the component has three-in-one functions, and the efficiency of an antenna is further enhanced.

A wireless communication device is provided. The wireless communication device comprises a circuit board, a key module and a sensing module. The key module is electrically connected with at least one key through the circuit board. The sensing module is electrically connected with the circuit board, wherein the circuit board is taken as an induction conductor of the sensing module. Therefore, according to the wireless communication device disclosed by the disclosure, the functions of the key module, the sensing module and an antenna module are integrated on a same component, so that the component has three-in-one functions, and the efficiency of an antenna is further enhanced.

An antenna switch of a radio frequency module selectively switches at least between connection between a first connection terminal and a common terminal and connection between a second connection terminal and the common terminal. A first connection terminal receives a signal in a first communication band. A second connection terminal receives a signal in a second communication band. When the second connection terminal and the common terminal are in connection with each other, a variable capacitor (C1, C2) of a filter circuit shifts the attenuation band of the filter circuit to a higher band than that when the first connection terminal and the common terminal are in connection with each other.

An antenna module includes a dielectric substrate having a multilayer structure, an antenna element and a ground electrode that are arranged at the dielectric substrate, and a matching circuit that is formed in a region between the antenna element and the ground electrode. A radio frequency signal is supplied via the matching circuit to the antenna element.

An antenna module includes a dielectric substrate having a multilayer structure, an antenna element and a ground electrode that are arranged at the dielectric substrate, and a matching circuit that is formed in a region between the antenna element and the ground electrode. A radio frequency signal is supplied via the matching circuit to the antenna element.

A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.

A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.

An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.