The present disclosure includes: an RFIC (110A) and an RFIC (110B) that are configured to respectively supply radio-frequency power to a first antenna group and a second antenna group; and a divider that divides a reference frequency signal input thereto and outputs the resulting first radio-frequency signals to the RFIC (110A) and the RFIC (110B). The divider is a Wilkinson-type first divider that is formed of a circuit system of a second impedance that is lower than a first impedance that is an impedance of signal transmission system into which the divider is inserted.

A hybrid antenna used for an electronic device is disclosed. A hybrid antenna comprises: a substrate comprising a first surface and a second surface and having an insulator; a first conductive member disposed on the first surface of the substrate and having a hole formed therein; a second conductive member disposed on a first area of the second surface of the substrate; and a third conductive member disposed on a second area of the second surface of the substrate and connected to a ground of an electronic device, wherein a first portion of the first conductive member operates as a first antenna for receiving a broadband signal and supplying power to the electronic device, and a second portion operates as a second antenna for receiving wireless power and supplying power to the electronic device, wherein a first power feeding unit is formed between the first antenna and second antenna.

A hybrid antenna used for an electronic device is disclosed. A hybrid antenna comprises: a substrate comprising a first surface and a second surface and having an insulator; a first conductive member disposed on the first surface of the substrate and having a hole formed therein; a second conductive member disposed on a first area of the second surface of the substrate; and a third conductive member disposed on a second area of the second surface of the substrate and connected to a ground of an electronic device, wherein a first portion of the first conductive member operates as a first antenna for receiving a broadband signal and supplying power to the electronic device, and a second portion operates as a second antenna for receiving wireless power and supplying power to the electronic device, wherein a first power feeding unit is formed between the first antenna and second antenna.

An electronic device may include a housing including a conductive area, a first conductive member comprising a conductive material in electrical contact with the conductive area, a first wireless communication circuit electrically connected to the conductive area, and a second wireless communication circuit electrically connected to the first conductive member. The first wireless communication circuit transmits and/or receives a first signal having a frequency of 6 GHz or less using the conductive area, and the second wireless communication circuit transmits and/or receives a second signal having a frequency of 20 GHz or more using at least part of the first conductive member and the conductive area.

An apparatus and associated method are provided involving a housing having a periphery configured to operate as a second antenna, a third antenna, and a fourth antenna. The periphery includes a top wall having a first slot formed therein, a first side wall having a second slot formed therein, and a second side wall having a third slot formed therein. The top wall is arranged between the first side wall and the second side wall, and a top portion of the periphery is defined between the second slot and the third slot. The top portion is divided into a first top side portion and a second top side portion via the first slot. Further, the first top side portion operates as the second antenna, and the second top side portion operates as both the third antenna and the fourth antenna.

An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

Provided is a method for matching antenna impedance in a wireless communication system. The method includes determining an approximate reflection coefficient based on an input signal and an output signal of a bidirectional coupler connected to a signal path of an antenna; determining an antenna impedance matching parameter corresponding to the determined approximate reflection coefficient by using a lookup table; and performing antenna impedance matching based on the antenna impedance matching parameter.

Provided is a method for matching antenna impedance in a wireless communication system. The method includes determining an approximate reflection coefficient based on an input signal and an output signal of a bidirectional coupler connected to a signal path of an antenna; determining an antenna impedance matching parameter corresponding to the determined approximate reflection coefficient by using a lookup table; and performing antenna impedance matching based on the antenna impedance matching parameter.

A magnetic field coupling element includes conductor patterns stacked with insulating layers interposed therebetween, and interlayer connection conductors that inter-connect the conductor patterns at predetermined positions. The conductor patterns include first, second, third, and fourth conductor patterns, and the interlayer connection conductors include first and second interlayer connection conductors. The first conductor pattern, the second conductor pattern, and the first interlayer connection conductor define a first coil, and the third conductor pattern, the fourth conductor pattern, and the second interlayer connection conductor define a second coil. The first coil and the second coil are disposed in a region of less than about of a stacking height of a multi-layer body including the insulating layers.