Patent classifications
H01Q5/335
ANTENNA APPARATUS AND MOBILE TERMINAL
An antenna apparatus includes an antenna, a first matching circuit and a second matching circuit, which are connected to the antenna, and an antenna switching apparatus, which is connected to the first matching circuit and the second matching circuit. Within the same time, only one of the first matching circuit and the second matching circuit is in operation. Operating frequency-band signals of the first matching circuit and the second matching circuit on the antenna are switched by the antenna switching apparatus, so as to be used at staggered times, thereby ensuring that operating frequency-band signals of the first matching circuit and the second matching circuit can be normally used in different scenarios, and effectively improving a performance of the antenna.
ANTENNA APPARATUS AND MOBILE TERMINAL
An antenna apparatus includes an antenna, a first matching circuit and a second matching circuit, which are connected to the antenna, and an antenna switching apparatus, which is connected to the first matching circuit and the second matching circuit. Within the same time, only one of the first matching circuit and the second matching circuit is in operation. Operating frequency-band signals of the first matching circuit and the second matching circuit on the antenna are switched by the antenna switching apparatus, so as to be used at staggered times, thereby ensuring that operating frequency-band signals of the first matching circuit and the second matching circuit can be normally used in different scenarios, and effectively improving a performance of the antenna.
ANTENNA MODULE AND COMMUNICATION APPARATUS EQUIPPED WITH THE SAME
An antenna module includes a dielectric substrate having a multilayer structure, a power supply element and a ground electrode (GND) disposed in or on the dielectric substrate, a parasitic element, a power supply wiring line, and first and second stubs to be connected to the power supply wiring line. The parasitic element is disposed in a layer between the power supply element and the ground electrode (GND). The power supply wiring line passes through the parasitic element and supplies radio frequency power to the power supply element. The first stub is connected to a position different from a connection position of the second stub in the power supply wiring line
ANTENNA MODULE AND COMMUNICATION APPARATUS EQUIPPED WITH THE SAME
An antenna module includes a dielectric substrate having a multilayer structure, a power supply element and a ground electrode (GND) disposed in or on the dielectric substrate, a parasitic element, a power supply wiring line, and first and second stubs to be connected to the power supply wiring line. The parasitic element is disposed in a layer between the power supply element and the ground electrode (GND). The power supply wiring line passes through the parasitic element and supplies radio frequency power to the power supply element. The first stub is connected to a position different from a connection position of the second stub in the power supply wiring line
Hearing device incorporating conformal folded antenna
A hearing device adapted to be worn by a wearer comprises a shell configured for placement on an exterior surface of an ear of the wearer. The shell comprises a first end, a second end, a bottom, a top, and opposing sides, wherein the bottom, top, and opposing sides extend between the first and second ends. Circuitry is provided within the shell comprising at least a microphone, signal processing circuitry, radio circuitry, and a power source. A folded antenna is coupled to the radio circuitry and extends longitudinally along one of the bottom and the top and along the opposing sides between the first and second ends. The folded antenna encompasses at least some of the circuitry and forms an elongated gap between the opposing sides. The elongated gap faces the other of the bottom and the top.
Hearing device incorporating conformal folded antenna
A hearing device adapted to be worn by a wearer comprises a shell configured for placement on an exterior surface of an ear of the wearer. The shell comprises a first end, a second end, a bottom, a top, and opposing sides, wherein the bottom, top, and opposing sides extend between the first and second ends. Circuitry is provided within the shell comprising at least a microphone, signal processing circuitry, radio circuitry, and a power source. A folded antenna is coupled to the radio circuitry and extends longitudinally along one of the bottom and the top and along the opposing sides between the first and second ends. The folded antenna encompasses at least some of the circuitry and forms an elongated gap between the opposing sides. The elongated gap faces the other of the bottom and the top.
System and method for transceiver and antenna programmability and generalized MIMO architectures
Embodiments generally disclosed herein relate to a sub-wavelength multi-port codesign approach between the unit transceiver element and the integrated EM interface to enable a generalized broadband MIMO array with individually programmable element patterns. The co-design approach allows processing of radiated signals at the antenna level distinct from classical arrays. The transmitter and receiver architectures with the integrated EM interface are implemented in 65-nm CMOS and have a bandwidth of 37-73 GHz. Wireless links with data rates up to 12 Gb/s are demonstrated across the spectrum with a wide range of reconfigurability of the active EM interface. The multifunctional EM interface and the broadband transceivers can enable future efficient and compact MIMO arrays for reliable links exploiting frequency, spatial, pattern and polarization diversities.
System and method for transceiver and antenna programmability and generalized MIMO architectures
Embodiments generally disclosed herein relate to a sub-wavelength multi-port codesign approach between the unit transceiver element and the integrated EM interface to enable a generalized broadband MIMO array with individually programmable element patterns. The co-design approach allows processing of radiated signals at the antenna level distinct from classical arrays. The transmitter and receiver architectures with the integrated EM interface are implemented in 65-nm CMOS and have a bandwidth of 37-73 GHz. Wireless links with data rates up to 12 Gb/s are demonstrated across the spectrum with a wide range of reconfigurability of the active EM interface. The multifunctional EM interface and the broadband transceivers can enable future efficient and compact MIMO arrays for reliable links exploiting frequency, spatial, pattern and polarization diversities.
Low-profile wideband antenna array configured to utilize efficient manufacturing processes
A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.
Low-profile wideband antenna array configured to utilize efficient manufacturing processes
A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.