An antenna arrangement is provided that includes a patch radiator, a feed arrangement, for the patch radiator and a cavity for the feed arrangement. The feed arrangement includes a slot in a conductive layer located between the patch radiator and the cavity.

Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.

A phase shifter and a manufacturing method thereof and an antenna and a manufacturing method thereof are provided. The phase shifter includes: first and second substrates opposite to each other; a first electrode provided on the first substrate and configured to receive a ground signal; a second electrode provided on a side of the second substrate facing towards the first substrate; liquid crystals encapsulated between the first substrate and the second substrate and driven by the first electrode and the second electrode to rotate; and a support structure provided between the first substrate and the second substrate and including a first spacer. The first spacer is located on a side of the second electrode facing away from the second substrate, and an orthographic projection of the first spacer on the second substrate is within an orthographic projection of the second electrode on the second substrate.

Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

An antenna module (100) includes a dielectric substrate (130) having a multilayer structure, a first radiating electrode (121) and a ground electrode (GND) that are disposed in the dielectric substrate (130), and a second radiating electrode (150) disposed in a layer between the first radiating electrode (121) and the ground electrode (GND). The first radiating electrode (121) is a power feed element to which radio frequency power is supplied. When the antenna module (100) is viewed in plan from a normal direction of the dielectric substrate (130), the first radiating electrode (121) and the second radiating electrode (150) at least partially overlap with each other. A thickness of the second radiating electrode (150) is larger than that of the first radiating electrode (121).

Systems and methods relating to patch antennas. A patch antenna has a substrate, a resonant metal plate at one side of the substrate, and a ground plane at the other opposite side of the substrate. Two feed pins are used to couple the antenna to other circuitry. The feed pins pass through the substrate and holes in at the ground plane. The feed pins are physically disconnected from both the resonant metal plate and the ground plane. The feed pins are capacitively coupled to the resonant metal plate to provide an electronic connection between other circuitry and the patch antenna.

Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.

The present invention discloses a broadband microstrip patch antenna (106) with U-shaped slot (116) with unequal arms for millimeter wave communications. The electromagnetic coupled type feed is used with microstrip line (103) printed on another substrate layer to minimize feed loss. The dimension of the patch, position and dimension of slots, height of dielectric layer, length, width of the microstrip line and so on are optimized to achieve the desired impedance and gain pattern over the 60 GHz frequency band.

A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.

An antenna according to one embodiment comprises: a substrate; a radiator attached to the substrate and radiating an electromagnetic signal; a metal plate antenna disposed to be spaced apart from the radiator in the vertical direction of the radiator; a fixing rod for supporting the metal plate antenna; and a sub patch antenna comprising a first surface attached to the fixing rod and a second surface attached to the substrate, wherein a partial region of the metal plate antenna and a partial region of the radiator overlap in the vertical direction.