A patch array has a routing printed circuit board with a plurality of layers for routing signals, and a plurality of printed circuit board patches that each has at least one through-via. The plurality of patches are mounted with the routing printed circuit board. In addition, the plurality of printed circuit board patches are formed in compliance with standard printed circuit board rules.

A millimeter wave antenna module includes a dielectric substrate, a ground plate, a radiation patch, a feeding structure, and a conductor structure. The dielectric substrate has a first side, on which the ground plate is disposed, and a second side, on which the radiation patch is disposed. The feeding structure is disposed between the radiation patch and the ground plate and penetrates the dielectric substrate and the ground plate. The conductor structure is disposed in the dielectric substrate. The conductor structure is spaced apart from the radiation patch and perpendicularly connected to the ground plate. The feeding structure is configured to feed the radiation patch to enable a first current to be generated on a surface of the radiation patch. Through couple-feeding between the conductor structure and the radiation patch, a second current perpendicular to a plane where the radiation patch is located can be excited and generated.

A method for initial timing synchronization for a WTRU to communicate with a network includes receiving an in-channel narrowband synchronization sequence from the network to enable initial coarse timing synchronization, determining coarse timing offset and a range between a beam source of a network transmitter and the WTRU, selecting a wideband sequence for fine timing synchronization using the estimated range, transmitting the selected wideband sequence for fine timing synchronization during an uplink timing occasion, receiving from the network a transmission of the selected wideband sequence for fine timing synchronization, and establishing fine timing synchronization between the WTRU and the network using the selected sequence.

A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

An antenna module of a base station in a wireless communication system includes: a dielectric; a radiator disposed on a horizontal plane spaced apart from a first surface of the dielectric by a predetermined first length; a first feeding unit disposed on the first surface of the dielectric and providing an electrical signal to the radiator; and a second feeding unit disposed on the first surface of the dielectric, the second feeding unit being extending along a direction in which the electrical signal is provided by the first feeding unit to the radiator. The second feeding unit being connected to the first feeding unit. A second surface of the second feeding unit is spaced apart from a third surface of the radiator by a predetermined second length.

Provided is a compact, uniplanar differential-fed transparent filtenna, comprising a dielectric substrate, and a metal ground plane attached to the dielectric substrate, wherein an avoidance slot is formed in the metal ground plane. A circular radiator is further attached to the dielectric substrate, a ring slot is formed in the circular radiator, shorting stubs are attached to the dielectric substrate on the two sides of the circular radiator, and the shorting stubs on the two sides are respectively connected to the ends of coplanar waveguide differential feedlines attached to the dielectric substrate on the two sides, and the other ends of the coplanar waveguide differential feedlines on the two sides are respectively connected to inner conductors of differential coaxial cables located on the side wall of the dielectric substrate, and outer conductors of the differential coaxial cables are connected to a bottom plate of the metal ground plane.

A substrate integrated waveguide fed antenna includes an electric dipole arrangement, a parasitic patch arrangement operably coupled with the electric dipole arrangement, and a feed structure. The feed structure includes a substrate integrated waveguide operably coupled with the electric dipole arrangement for exciting the electric dipole arrangement. A slotted conductive surface with a slot is arranged between the electric dipole arrangement and the feed structure for operably coupling the feed structure with the electric dipole arrangement.

The present invention provides a self-filtering millimeter-wave wideband multilayer planar antenna. The antenna includes a first layer having a slot feed. A second layer includes at least a pair of probes fed by the slot feed from the first layer. A third layer includes at least two substantially planar radiating patches each patch respectively coupled to one of the probes on the second layer. The radiating patches are arranged to radiate a millimeter-wavelength electromagnetic wave when the slot feed receives excitation energy and transmits the energy to the radiating patch through the respective probe. The self-filtering antenna does not require a resonant cavity structure coupled to the radiating patches. Antenna arrays of arbitrary numbers of antenna elements may be constructed from the self-filtering antenna. Such arrays are particularly suitable for 5G mm-wave backhaul communications.

An antenna structure has a stack of dielectric layers and metal layers. The antenna structure includes a radiator and a grounding structure. The radiator has a parasitic radiator element, a main radiator element and a ground plane element respectively in a first metal layer, a second metal layer and a third metal layer of the metal layers. The parasitic radiator element and the main radiator element are physically spaced by a first dielectric layer of the dielectric layers. The main radiator element and the ground plane element are physically spaced by a second dielectric layer of the dielectric layers. The grounding structure laterally surrounds between the main radiator element and the ground plane element for blocking electromagnetic radiation, but not between the parasitic radiator element and the main radiator element.

A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.