An antenna pattern used in a UHF frequency band RFID inlay is provided with a substance; a dipole antenna formed from a metal foil upon the front surface of the substance; and a sub-element formed from a metal foil upon the back surface of the substance, wherein the dipole antenna is provided with a loop portion having a IC chip connecting portion; a pair of meanders configured to respectively extend from the loop portion so as to be line symmetrical; and capacitance hats, the sub-element has a pair of U-shapes, and a part of the sub-element overlaps with the dipole antenna through the substance.

One aspect of the present disclosure provides a terahertz-wave detector including a semiconductor substrate, an active element formed on the semiconductor substrate and a first resistive portion electrically connected in parallel with the active element.

An antenna for a Radio Frequency Identification (RFID) transponder, including: an inductive loop with terminals for connection with an RFID chip; and an electromagnetically resonant structure positioned in a same plane as the inductive loop; wherein a resonant frequency of the resonant structure corresponds to a designed operating frequency in a frequency band of the RFID transponder; and wherein the electromagnetically resonant structure is electrically and physically separated from the inductive loop and capacitively coupled to the inductive loop; and the electromagnetically resonant structure includes one or more electrical discontinuities within the electromagnetically resonant structure; wherein the antenna is adapted and configured to have a non-omni directional radiation pattern and with an input impedance substantially conjugate matches an input impedance of the RFID chip at the designed operating frequency.

A hearing assistance device includes a housing component (12) hosting a transceiver (68) and processing circuitry arranged in a compact block structure (50). A small feed loop (40) is mounted on the compact block structure (50), and is electrically connected to the transceiver (68). The compact block structure (50) is adapted for carrying the small feed loop (40), and the housing component (12) includes an integrated antenna element (30, 80). The housing component (12) and the compact block structure (50) are provided with a set of cooperating mechanical guiding components for maintaining the small feed loop (40) and the antenna element (30, 80) in a well-defined mechanical connection.

An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.

An antenna assembly comprises a plurality of radiating elements; an unshielded circuit; and an input terminal; wherein the radiating elements are connected to the unshielded circuit through a plurality of cables, and the unshielded circuit is connected to the input terminal through an input cable; and wherein at least one of the plurality of cables and the input cable is connected to an open connect line.

A dipole antenna is disclosed. The dipole antenna includes a first arm, a second arm, and a first conductive plate. The first conductive plate is placed inside one of the first arm or the second arm. The first conductive plate creates a cavity inside the one of the first arm or the second arm.

A wireless communication device is provided for transmitting and receiving a high-frequency signal having a first frequency for communication is disclosed. The device includes a loop pattern having a first electrode and a second electrode as both ends, an antenna pattern, a third electrode capacitively coupled to the first electrode, and a fourth electrode capacitively coupled to the second electrode. The device includes an RFIC having a capacitive impedance at a second frequency higher than the first frequency, and a first current path and a second current path connected in parallel with each other between the third electrode and the fourth electrode. The RFIC is included in the first current path and the second current path has an inductive impedance at a second frequency.

A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.

An RFIC module is provided that includes a base material having a first face and a second face opposite to each other, an RFIC mounted above the first face of the base material, and RFIC-side terminal electrodes that are formed on the first face of the base material and are connected to the RFIC. An insulator film is formed on the surface of the RFIC-side terminal electrode, and conductor films facing the RFIC-side terminal electrode are formed on the insulator film. Moreover, additional capacitances are formed between the RFIC-side terminal electrodes and the conductor films.