Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

A mezzanine power pin includes a dual layer pin body extending between a pin top having an upper power interface and a pin bottom having a lower power interface. The dual layer pin body has a base metal core and an outer metal oxide layer combined with the base metal core defining an outermost layer of the dual layer pin body. The mezzanine power pin includes an upper fastener coupled to the pin top to mechanically and electrically connect an upper component to the upper power interface. The mezzanine power pin includes a lower fastener coupled to the pin bottom to mechanically and electrically connect a lower component to the lower power interface. The base metal core is configured to electrically connect the upper component and the lower component through the base metal core.

Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.

An electrically conductive contact is disclosed and includes a fastening section integrally joined between a body and a tapered lead-in section. The fastening section is adapted for press-fitting into a hole of a substrate, such as a printed circuit board. The fastening section includes a pair of beams with a web joined in-between. The web has a center portion disposed between a pair of ramp portions. Each of the ramp portions has a sloping planar surface. The center portion has an opening extending therethrough and is offset in a normal direction. The fastening section is configured such that when the fastening section is press-fit into the hole of the substrate, the beams deflect both laterally and angularly.

A connector includes a metal cylinder with three or more slots cut from a first end and three or more slots cut from a second end which are intercalated between the slots from the first end, whereby the connector is radially compressible along its entire length. The connector is adapted for insertion at one end into a hole in a circuit board, thereby making electrical contact to traces in the circuit board.

A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

A voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board. The second circuit board assembly includes a second printed circuit board, at least one output capacitor, a plurality of ball grid arrays and at least one bonding pad. The second printed circuit board includes a first surface and a second surface. The plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The at least one bonding pad is arranged beside the first surface of the second printed circuit board. The magnetic core assembly is arranged between the first circuit board assembly and the second circuit board assembly and electrically connected with the at least one bonding pad. The at least one output capacitor is embedded within the second circuit board assembly.

The present invention relates to a planar converter, comprising: a magnetic unit comprising a first planar winding and two second planar windings magnetically coupled to each other and a magnetic core assembly; two closed circuits each comprises the first planar winding, a switch, and has a first connection point and a second connection point; two PCBs each provided with at least one of the closed circuits thereon; and two first connectors each comprising two welding ends opposite to each other, wherein the two welding ends of one of the two first connectors are connected to the first connection points of the two closed circuits, respectively, and the two welding ends of another one of the two first connectors are connected to the second connection points of the two closed circuits, respectively, and the two closed circuits are connected in parallel.