An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.

The invention relates to an electric interface, in particular an interposer, having a first connection plane with at least one first contact surface pair, each of which has a first and second contact surface, and a second connection plane with at least one second contact surface pair, each of which has a third and a fourth contact surface. For each of a first and second contact surface pair, a first electric connection electrically connects the first contact surface of the first connection plane to the third contact surface of the second connection plane, and a second electric connection electrically connects the second contact surface of the first connection plane to the fourth contact surface of the second connection plane. The first electric connection between the first and third contact surface has a specified first geometric length, and the second electric connection between the second and fourth contact surface has a specified second geometric length, the first and second geometric length being different.

An electronic control connector (30) including at least an input orifice (32a), at least a fixing leg (33) and at least a terminal (34), the terminal (34) being inserted inside the input orifice (32a), the electronic control connector (30) being fixed to a printed circuit board (10) of an electronic control (50), by a fixing between the fixing leg (33) and a fixing orifice (16) disposed on the printed circuit board (10) of the electronic control (50), the fixing of the electronic control connector (30) to the printed circuit board (10) also establishing an electrical connection between the terminal (34) of the electronic control connector (30) and the tracks of the printed circuit board (10) of the electronic control (50).

Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.

Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

Electronic devices and associated methods are shown including a connector mounted to a printed circuit board (PCB). Examples shown include a number of ground vias passing through the PCB to a second side of the PCB, wherein the number of ground vias is smaller than a number of ground sites. Selected examples include an optoelectronic connector mounted using surface mount technology.

A socket pin for electrically connecting a semiconductor substrate to a test substrate, comprising: a pin head; a pin body configured to support the pin head; and a length adjusting part provided below the pin body; wherein: the length adjusting part comprises at least a portion protruding from the pin body and a resilient structure; and the length adjusting part is movable to change a length of the portion protruding from the pin body as the resilient structure distorts.